Guide

4 Intel
®
Celeron
®
D Processor for Embedded Applications Thermal Design Guide
Contents
Figures
1 FC-mPGA4 Package Mechanical Drawing (Sheet 1 of 2)..........................................................10
2 FC-mPGA4 Package Mechanical Drawing (Sheet 2 of 2)..........................................................11
3 Motherboard Volumetric Constraint Footprint Definition and Height Restrictions—
ATX Form Factor (Sheet 1 of 2) .................................................................................................13
4 Motherboard Volumetric Constraint Footprint Definition and Height Restrictions—
ATX Form Factor (Sheet 2 of 2) .................................................................................................14
5 Volumetric Constraint for ATX/Desktop Form Factor Enabling Components.............................15
6 1U and 2U Reference Thermal Solution Primary Side PCB Volumetric Constraints .................16
7 1U and 2U Reference Thermal Solution Secondary Side PCB Volumetric Constraints.............17
8 Heatsink, Fan, and Shroud Assembly Volumetric Constraint, ATX Form Factor .......................20
9 Processor Thermal Characterization Parameter Relationships..................................................24
10 Processor IHS Temperature Measurement Location .................................................................27
11 Thermal Resistance Values for Various Operating Temperatures.............................................30
12 1U Thermal Solution Z-Height Constraints.................................................................................31
13 2U Thermal Solution Z-Height Constraints.................................................................................32
14 2U Reference Thermal Solution: Exploded View .......................................................................33
15 Retention Mechanism 1..............................................................................................................46
16 Retention Mechanism 2..............................................................................................................47
17 1U Reference Thermal Solution Heatsink ..................................................................................48
18 2U Reference Thermal Solution Heatsink ..................................................................................49
Tables
1 Related Documents......................................................................................................................6
2 Definitions of Terms...................................................................................................................... 6
3 Processor Thermal Specifications..............................................................................................29
4 Recommended Thermal Solutions .............................................................................................30
5 Package Static and Dynamic Load Specifications .....................................................................35
6 Vendor Contact Information........................................................................................................43
Revision History
Date Revision Description
June 2004 001 Initial public release of this document.