Guide

Intel
®
Celeron
®
D Processor for Embedded Applications Thermal Design Guide 5
Introduction
1.0 Introduction
This document describes thermal design guidelines for the Intel
®
Celeron
®
D Processor for
Embedded Applications in the Flip-Chip Pin Grid Array (FC-mPGA4) package that interfaces with
the motherboard through a mPGA478B socket. Detailed mechanical and thermal specifications for
these processors may be found in the processor datasheet.
The information provided in this document is for reference only and additional validation must be
performed prior to implementing the designs into final production. The intent of this document is to
assist OEMs with the development of thermal solutions for their individual designs. The final
heatsink solution, including the heatsink, attachment method, and Thermal Interface Material
(TIM) must comply with the mechanical design, environmental, and reliability requirements
delineated in the Intel Celeron D Processor Datasheet. It is the responsibility of each OEM to
validate the thermal solution design with their specific applications.
1.1 Importance of Thermal Management
The objective of thermal management is to ensure that the temperatures of all components in a
system are maintained within their functional temperature range. Within this temperature range, a
component, and in particular its electrical circuits, is expected to meet its specified performance
requirements. Operation outside the functional temperature range may degrade system
performance, cause logic errors or cause component and/or system damage. Temperatures
exceeding the maximum operating limit of a component may result in irreversible changes in the
operating characteristics of this component.
In a system environment, the processor temperature is a function of both system and component
thermal characteristics. The system-level thermal constraints consist of the local ambient air
temperature and airflow over the processor as well as the physical constraints at and above the
processor. The processor temperature depends in particular on the component power dissipation,
the processor package thermal characteristics, and the processor thermal solution.
All of these parameters are aggravated by the continued push of technology to increase processor
performance levels (higher operating speeds, GHz) and packaging density (more transistors). As
operating frequencies increase and packaging size decreases, the power density increases while the
thermal solution space and airflow typically become more constrained or remain the same within
the system. The result is an increased importance on system design to ensure that the thermal
design requirements are met for each component, including the processor, in the system.
1.2 Document Goals
The goal of this document is to describe the thermal characteristics of the Intel Celeron D
Processor and provide guidelines for meeting the thermal requirements imposed on
single-processor systems. The thermal solutions presented in this document are designed for
embedded computing applications including ATX, 2U, and 1U server form factors.