2 Note

Introduction
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1 Introduction
The Intel
®
Socket Test Technology for the LGA775 socket is a test chip that enables
testing for the mechanical integrity and electrical continuity of both socket-to-board
solder ball connectivity and socket-to-processor contact connectivity. Once inserted
into the board’s LGA775 socket, the test chip works with either in-circuit testers (ICT)
or manufacturing defect analyzers (MDA) that have access to all the socket nets
through test fixture probes.
An ICT uses digital test vectors which execute very quickly when power is applied to
the board—typically less than a few milliseconds depending upon test head capability.
An MDA doesn’t power the board, but uses its analog measurement capability. Test
time using an MDA is typically longer.
The test chip with product code JM8HKZLVA was developed to support the Intel®
91X/925/925XE Express chipset based products. Refer to the Intel® Socket Test
Technology for the LGA775 Socket – Product Code JM8HKZLVA document for further
information.
The test chip with part number JM8YKZLVA described in this document supports the
Intel® 955X, 945, 946, and 965 Express chipset based products, and is not
compatible for testing Intel 91X/925/925E Express chipset based products.
Figure 1 - Intel
®
Socket Test Technology for the LGA775 Socket - Product Code
JM8YKZLVA (LGA775YP)