Note

Introduction
8 Application Note
1.1 Terminology
1.2 Reference Documents
NOTE: This section will be updated in the next version.
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Table 1-1. Terms and Descriptions
Term Description
ICT In-circuit Test
LGA771 socket Processor in the 771-land package mates with the system board through a
surface mount, 771-pin, LGA (Land Grid Array) socket.
MDA Manufacturing Defect Analyzer
VCCP Processor core voltage
VTT IO termination voltage for the front side bus
Table 1-2. Reference Documents
Documents Notes
TBD 1