Intel Celeron Processor on 0.13 Micron Process in the 478-Pin Package Datasheet

6 Intel
®
Celeron
®
Processor on 0.13 Micron Process in the 478-Pin Package Datasheet
Tables
1 References..........................................................................................................11
2 VCCVID Pin Voltage Requirements....................................................................15
3 Voltage Identification Definition...........................................................................16
4 System Bus Pin Groups......................................................................................19
5 BSEL[1:0] Frequency Table for BCLK[1:0] .........................................................20
6 Processor DC Absolute Maximum Ratings.........................................................21
7 Voltage and Current Specifications.....................................................................22
8 VCC Static and Transient Tolerance...................................................................23
9 System Bus Differential BCLK Specifications .....................................................25
10 AGTL+ Signal Group DC Specifications .............................................................25
11 Asynchronous GTL+ Signal Group DC Specifications........................................26
12 PWRGOOD and TAP Signal Group DC Specifications ......................................26
13 ITPCLKOUT[1:0] DC Specifications....................................................................27
14 BSEL [1:0] and VID[4:0] DC Specifications.........................................................27
15 AGTL+ Bus Voltage Definitions...........................................................................28
16 System Bus Differential Clock Specifications......................................................29
17 System Bus Common Clock AC Specifications ..................................................29
18 System Bus Source Synch AC Specifications AGTL+ Signal Group..................30
19 Miscellaneous Signals AC Specifications ...........................................................31
20 System Bus AC Specifications (Reset Conditions).............................................31
21 TAP Signals AC Specifications ...........................................................................31
22 ITPCLKOUT[1:0] AC Specifications....................................................................32
23 BCLK Signal Quality Specifications ....................................................................41
24 Ringback Specifications for AGTL+ and Asynchronous GTL+ Signals
Groups ................................................................................................................42
25 Ringback Specifications for PWRGOOD Input and TAP Signal Group ..............43
26 1.525V VID Source Synchronous (400 MHz) AGTL+ Signal Group
Overshoot/Undershoot Tolerance.......................................................................47
27 1.525 V VID Source Synchronous (200 MHz) AGTL+ Signal Group
Overshoot/Undershoot Tolerance.......................................................................48
28 1.525 V VID Common Clock (100 MHz) AGTL+ Signal Group
Overshoot/Undershoot Tolerance.......................................................................48
29 1.525 V VID Asynchronous GTL+, PWRGOOD Input, and TAP Signal
Group Overshoot/Undershoot Tolerance ............................................................48
30 Description Table for Processor Dimensions ......................................................52
31 Package Dynamic and Static Load Specifications ..............................................54
32 Processor Mass ..................................................................................................55
33 Processor Material Properties.............................................................................55
34 Pin Listing by Pin Name......................................................................................60
35 Pin Listing by Pin Number...................................................................................66
36 Signal Description ...............................................................................................72
37 Processor Thermal Design Power ......................................................................83
38 Power-On Configuration Option Pins ..................................................................85
39 Thermal Diode Parameters .................................................................................90
40 Thermal Diode Interface......................................................................................90
41 Fan Heatsink Power and Signal Specifications...................................................95
42 Boxed Processor Fan Heatsink Set Points ......................................................... 99