Intel Celeron Processor in the 478-Pin Package at 1.80 GHz Datasheet

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Intel
®
Celeron
®
Processor in the 478-Pin Package, Rev 0.8
1.0 Introduction.........................................................................................................................9
1.1 Terminology.......................................................................................................... 9
1.1.1 Processor Packaging Terminology........................................................ 10
1.2 References ......................................................................................................... 11
2.0 Electrical Specifications....................................................................................................13
2.1 System Bus and GTLREF .................................................................................. 13
2.2 Power and Ground Pins...................................................................................... 13
2.3 Decoupling Guidelines........................................................................................ 13
2.3.1 Vcc Decoupling...................................................................................... 14
2.3.2 System Bus AGTL+ Decoupling ............................................................ 14
2.3.3 System Bus Clock (BCLK[1:0]) and Processor Clocking....................... 14
2.3.4 Phase Lock Loop (PLL) Power and Filter.............................................. 16
2.4 Reserved, Unused, and TESTHI Pins ................................................................ 18
2.5 System Bus Signal Groups................................................................................. 19
2.6 Asynchronous GTL+ Signals .............................................................................. 20
2.7 Test Access Port (TAP) Connection................................................................... 20
2.8 System Bus Frequency Select Signals (BSEL[1:0]) ........................................... 20
2.9 Maximum Ratings............................................................................................... 21
2.10 Processor DC Specifications .............................................................................. 21
2.10.1 Flexible Motherboard Guidelines (FMB)................................................ 22
2.11 AGTL+ System Bus Specifications..................................................................... 27
2.12 System Bus AC Specifications ........................................................................... 28
2.13 Processor AC Timing Waveforms....................................................................... 32
3.0 System Bus Signal Quality Specifications........................................................................39
3.1 BCLK Signal Quality Specifications and Measurement Guidelines.................... 39
3.2 System Bus Signal Quality Specifications and Measurement Guidelines .......... 40
3.2.1 Overshoot/Undershoot Guidelines......................................................... 43
3.2.1.1 Overshoot/Undershoot Magnitude............................................ 43
3.2.1.2 Overshoot/Undershoot Pulse Duration ..................................... 43
3.2.1.3 Activity Factor ........................................................................... 44
3.2.1.4 Reading Overshoot/Undershoot Specification Tables.............. 44
3.2.1.5 Determining if a System Meets the Over/Undershoot Specifications45
4.0 Package Mechanical Specifications.................................................................................49
4.1 Package Load Specifications.............................................................................. 52
4.2 Processor Insertion Specifications...................................................................... 53
4.3 Processor Mass Specifications........................................................................... 53
4.4 Processor Materials............................................................................................ 53
4.5 Processor Markings............................................................................................ 53
4.6 Processor Pin-Out Coordinates.......................................................................... 54
5.0 Pin Listing and Signal Definitions.....................................................................................57
5.1 Intel
®
Celeron® Processor in the 478-Pin Package Pin Assignments................ 57
5.2 Signal Descriptions............................................................................................. 72
6.0 Thermal Specifications and Design Considerations.........................................................79
6.1 Thermal Specifications ....................................................................................... 80
6.2 Thermal Analysis ................................................................................................ 81
6.2.1 Thermal Solution Performance.............................................................. 81