Intel Celeron Processor in the 478-Pin Package at 1.80 GHz Datasheet

10 Datasheet
Intel
®
Celeron
®
Processor in the 478-Pin Package
1.1.1 Processor Packaging Terminology
Commonly used terms are explained here for clarification:
• Celeron
®
processor in the 478-pin package (also referred as the Processor) — 0.18 micron
processor core in the FC-PGA2 package with a 128 KB L2 cache.
• Pentium
®
4 processor in the 478-pin package — 0.18 micron Pentium
®
4 processor core in
the FC-PGA2 package with a 256 KB L2 cache.
• Processor — In this document, the term processor refers to the
Celeron
processor in the 478-pin package.
• Keepout zone — The area on or near the processor that system design can not utilize.
• Intel
®
845 chipset — Chipset that supports PC133 and DDR memory technology for the
Celeron processor in the 478-pin package.
• Intel
®
845G chipset — Chipset with embedded graphics that supports DDR memory
technology for the Celeron processor in the 478-pin package.
• Intel
®
845E chipset — Chipset that supports DDR memory technology for the Celeron
processor in the 478-pin package.
• Processor core — Processor core die with integrated L2 cache.
• FC-PGA2 package — Flip-Chip Pin Grid Array package with 50 mil pin pitch and Integrated
heat spreader.
• mPGA478B socket — Surface mount, 478 pin, Zero Insertion Force (ZIF) socket with 50 mil
pin pitch. The socket mates the processor to the system board.
• Integrated heat spreader —The surface used to make contact between a heatsink or other
thermal solution and the processor. Integrated heat spreader is abbreviated IHS.
• Retention mechanism —The structure mounted on the system board that provides support and
retention of the processor heatsink.