Intel Celeron Processor in the 478-Pin Package at 1.80 GHz Datasheet

Intel
®
Celeron
®
Processor in the 478-Pin Package
4 Datasheet
6.0 Thermal Specifications and Design Considerations.........................................................79
6.1 Thermal Specifications........................................................................................80
6.2 Thermal Analysis.................................................................................................81
6.2.1 Thermal Solution Performance...............................................................81
6.2.2 Measurements For Thermal Specifications............................................81
6.2.2.1 Processor Case Temperature Measurement ............................81
7.0 Features...........................................................................................................................83
7.1 Power-On Configuration Options ........................................................................83
7.2 Clock Control and Low Power States..................................................................83
7.2.1 Normal State—State 1 ...........................................................................83
7.2.2 AutoHALT Powerdown State—State 2 ..................................................83
7.2.3 Stop-Grant State—State 3 .....................................................................85
7.2.4 HALT/Grant Snoop State—State 4 ........................................................85
7.2.5 Sleep State—State 5..............................................................................86
7.2.6 Deep Sleep State—State 6 ....................................................................86
7.3 Thermal Monitor ..................................................................................................87
7.3.1 Thermal Diode........................................................................................88
8.0 Boxed Processor Specifications....................................................................................... 89
8.1 Mechanical Specifications................................................................................... 90
8.1.1 Boxed Processor Cooling Solution Dimensions.....................................90
8.1.2 Boxed Processor Fan Heatsink Weight..................................................91
8.1.3 Boxed Processor Retention Mechanism and Heatsink Attach
Clip Assembly ........................................................................................ 91
8.2 Electrical Requirements ......................................................................................92
8.2.1 Fan Heatsink Power Supply...................................................................92
8.3 Thermal Specifications........................................................................................94
8.3.1 Boxed Processor Cooling Requirements ...............................................94
8.3.2 Variable Speed Fan ...............................................................................95
9.0 Debug Tools Specifications..............................................................................................97
9.1 Logic Analyzer Interface (LAI).............................................................................97
9.1.1 Mechanical Considerations ....................................................................97
9.1.2 Electrical Considerations........................................................................97