Intel Celeron Processor in the 478-Pin Package at 1.80 GHz Datasheet

8Intel
®
Celeron
®
Processor in the 478-Pin Package, Rev 0.8
100 10336
6.2.2 Measurements For Thermal Specifications ............................................81
6.2.2.1 Processor Case Temperature Measurement.............................81
7.0 Features...........................................................................................................................83
7.1 Power-On Configuration Options.........................................................................83
7.2 Clock Control and Low Power States ..................................................................83
7.2.1 Normal State—State 1............................................................................83
7.2.2 AutoHALT Powerdown State—State 2...................................................83
7.2.3 Stop-Grant State—State 3......................................................................85
7.2.4 HALT/Grant Snoop State—State 4.........................................................85
7.2.5 Sleep State—State 5 ..............................................................................86
7.2.6 Deep Sleep State—State 6 ....................................................................86
7.3 Thermal Monitor ..................................................................................................87
7.3.1 Thermal Diode ........................................................................................88
8.0 Boxed Processor Specifications....................................................................................... 89
8.1 Mechanical Specifications ...................................................................................90
8.1.1 Boxed Processor Cooling Solution Dimensions .....................................90
8.1.2 Boxed Processor Fan Heatsink Weight..................................................91
8.1.3 Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly91
8.2 Electrical Requirements.......................................................................................92
8.2.1 Fan Heatsink Power Supply ...................................................................92
8.3 Thermal Specifications ........................................................................................94
8.3.1 Boxed Processor Cooling Requirements................................................94
8.3.2 Variable Speed Fan................................................................................95
9.0 Debug Tools Specifications..............................................................................................97
9.1 Logic Analyzer Interface (LAI) .............................................................................97
9.1.1 Mechanical Considerations ....................................................................97
9.1.2 Electrical Considerations ........................................................................97