Intel Celeron Processor for the PGA370 Socket up to 1.40 GHz on 0.13 Micron Process Datasheet

Intel
®
Celeron
®
Processor for PGA370 up to 1.40 GHz on 0.13 µ Process
4 Datasheet
3.4 VTT_PWRGD Signal Quality Specification .........................................................49
3.4.1 Transition region ....................................................................................49
3.4.2 Transition time........................................................................................ 50
3.4.3 Noise ......................................................................................................50
4.0 Thermal Specifications and Design Considerations.........................................................51
4.1 Thermal Specifications........................................................................................ 51
4.1.1 THERMTRIP# Requirement................................................................... 51
4.1.2 Thermal Diode........................................................................................52
4.2 Thermal Metrology ..............................................................................................52
5.0 Mechanical Specifications................................................................................................53
5.1 FC-PGA2 Mechanical Specifications ..................................................................53
5.2 Recommended Mechanical Keep-Out Zones .....................................................55
5.3 Processor Markings ............................................................................................56
5.4 Processor Signal Listing......................................................................................57
6.0 Boxed Processor Specifications.......................................................................................68
6.1 Mechanical Specifications...................................................................................68
6.1.1 Mechanical Specifications for the FC-PGA2 Package ...........................68
6.1.2 Boxed Processor Heatsink Weight.........................................................70
6.2 Thermal Specifications........................................................................................ 70
6.2.1 Boxed Processor Cooling Requirements ...............................................70
6.2.2 Boxed Processor Thermal Cooling Solution Clip ...................................71
6.3 Electrical Requirements for the Boxed Processor...............................................71
6.3.1 Electrical Requirements .........................................................................71
7.0 Processor Signal Description...........................................................................................73
7.1 Alphabetical Signals Reference ..........................................................................73
7.2 Signal Summaries...............................................................................................80