Intel Celeron Processor in the 478-Pin Package at 1.80 GHz Datasheet

Datasheet 49
Intel
®
Celeron
®
Processor in the 478-Pin Package
4.0 Package Mechanical Specifications
The Celeron processor in the 478-pin package is packaged in a Flip-Chip Pin Grid Array (FC-
PGA2) package. Components of the package include an integrated heat spreader (IHS), processor
core, and the substrate which is the pin carrier. Mechanical specifications for the processor are
given in this section. See Section 1.1 for a terminology listing. The processor socket which accepts
the Celeron
processor in the 478-pin package is referred to as a 478-Pin micro PGA (mPGA478B)
socket. See the Intel
®
Pentium
®
4 Processor 478-Pin Socket (mPGA478B) Socket Design
Guidelines for complete details on the mPGA478B socket.
Notes: The following notes apply to Figure 22 through Figure 27.
1. Unless otherwise specified, the following drawings are dimensioned in millimeters.
2. All dimensions are not tested, but guaranteed by design characterization.
3. Figures and drawings labeled as “Reference Dimensions” are provided for informational
purposes only. Reference dimensions are extracted from the mechanical design database and
are nominal dimensions with no tolerance information applied. Reference dimensions are
NOT checked as part of the processor manufacturing process. Unless noted as such,
dimensions in parentheses without tolerances are reference dimensions.
4. Drawings are not to scale.
NOTE: The figure is not drawn to scale and is for reference only. The socket and system board are shown as a
reference only.
Figure 22. Exploded View of Processor Components on a System Board
35 mm Square
31 mm
System Board
mPGA478B
Socket
Heat Spreader
Substrate
478 Pins