Guide

Intel
®
Celeron
®
D Processor for Embedded Applications Thermal Design Guide 3
Contents
Contents
1.0 Introduction....................................................................................................................................5
1.1 Importance of Thermal Management....................................................................................5
1.2 Document Goals ...................................................................................................................5
1.3 Document Scope ..................................................................................................................6
1.4 Related Documents ..............................................................................................................6
1.5 Definitions of Terms..............................................................................................................6
2.0 Design Guidelines .........................................................................................................................9
2.1 Mechanical Guidelines..........................................................................................................9
2.1.1 Processor Package..................................................................................................9
2.1.2 Motherboard Volumetric Constraint Requirements................................................12
2.1.3 Heatsink Attach......................................................................................................18
2.1.3.1 Retention Mechanism-ATX Form Factor ...............................................18
2.1.3.2 Heatsink Attach Clip...............................................................................19
2.1.3.3 Additional Requirements for Solutions Using Reference ATX Heatsink
and Reference Clip ................................................................................19
2.1.4 Retention Mechanism-1U and 2U Form Factor .....................................................20
3.0 Characterizing Cooling Performance Requirements ...............................................................23
3.1 Example of Cooling Performance .......................................................................................24
3.2 Looking at the Whole Thermal Solution..............................................................................25
4.0 Thermal Design Guidelines ........................................................................................................27
4.1 Processor Case Temperature.............................................................................................27
4.2 Thermal Specifications .......................................................................................................28
4.3 T
control.................................................................................................................................................................. 28
4.4 Thermal Solution Requirements .........................................................................................29
4.5 Recommended Thermal Solutions .....................................................................................30
4.5.1 Desktop/ATX Form Factor .....................................................................................30
4.5.2 1U Reference Thermal Solution ............................................................................30
4.5.3 2U Reference Thermal Solution ............................................................................31
4.6 Interface to Package Requirements ...................................................................................34
4.7 Thermal Interface Material Requirements ..........................................................................34
4.8 Package and Socket Load Specifications...........................................................................35
5.0 Thermal Metrology for the Intel
®
Celeron
®
D Processor for Embedded Applications ........37
6.0 Thermal Test Vehicle Information..............................................................................................39
7.0 Thermal Monitor ..........................................................................................................................41
8.0 Vendor Data .................................................................................................................................43
A Mechanical Drawings..................................................................................................................45