Intel® Celeron® Processor 200Δ Sequence Thermal and Mechanical Design Guidelines — Supporting the Intel® Celeron® processor 220 Δ October 2007 318548-001
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Contents 1 Introduction .....................................................................................................7 1.1 1.2 1.3 2 Processor Thermal/Mechanical Information ......................................................... 11 2.1 2.2 2.3 2.4 3 Mechanical Requirements ...................................................................... 11 2.1.1 Processor Package................................................................... 11 2.1.2 Heatsink Attach ..............................
Appendix A Heatsink Clip Load Metrology ............................................................................ 43 A.1 A.2 A.3 Overview ............................................................................................43 Test Preparation...................................................................................43 A.2.1 Heatsink Preparation ...............................................................43 A.2.2 Typical Test Equipment .................................................
Tables Table Table Table Table Table Table 1. 2. 3. 4. 5. 6. Micro-FCBGA Package Mechanical Specifications ..................................... 12 Thermal Specifications for Intel® Celeron® Processor 200 Sequence .......... 19 System Thermal Solution Design Requirement ....................................... 22 Test Accessories ................................................................................33 Typical Test Equipment .......................................................................
Revision History Revision Number -001 Description Revision Date • Initial Release October 2007 § 6 Thermal and Mechanical Design Guidelines
Introduction 1 Introduction 1.1 Document Goals and Scope 1.1.1 Importance of Thermal Management The objective of thermal management is to ensure that the temperatures of all components in a system are maintained within their functional temperature range. Within this temperature range, a component is expected to meet its specified performance. Operation outside the functional temperature range can degrade system performance, cause logic errors or cause component and/or system damage.
Introduction 1.1.3 Document Scope This design guide supports the following processors: • Intel® Celeron® Processor 200 sequence applies to the Intel® Celeron® processor 220. In this document the Intel Celeron Processor 200 sequence will be referred to as “the processor”. In this document when a reference is made to “the processor” it is intended that this includes all the processors supported by this document. If needed for clarity, the specific processor will be listed.
Introduction 1.2 Reference Documents Material and concepts available in the following documents may be beneficial when reading this document. Document 1.3 Document No./Location Intel® Celeron® Processor 200 Sequence Datasheet http://developer.intel .com/design/processo r/datashts/318546.ht m Power Supply Design Guide for Desktop Platform Form Factors (Rev 1.1) http://www.formfacto rs.org/ ATX Thermal Design Suggestions http://www.formfactors. org/ microATX Thermal Design Suggestions http://www.
Introduction Term Description (TS – TA) / Total Package Power. Note: Heat source must be specified for Ψ measurements. TIM Thermal Interface Material: The thermally conductive compound between the heatsink and the processor die surface. This material fills the air gaps and voids, and enhances the transfer of the heat from the processor die surface to the heatsink. PD Processor total power dissipation (assuming all power dissipates through the processor die).
Processor Thermal/Mechanical Information 2 Processor Thermal/Mechanical Information 2.1 Mechanical Requirements 2.1.1 Processor Package The Intel Celeron processor 200 sequence is available in a 479-pin Micro-FCBGA package, as shown in Figure 1 to Figure 3. The processor uses a Flip-Chip Ball Grid Array (FC-BGA6) package technology that directly solder down to a 479-pin footprint on PCB surface. Mechanical specifications of the package are listed in Table 1.
Processor Thermal/Mechanical Information Table 1. Micro-FCBGA Package Mechanical Specifications Symbol Parameter Min Max Unit Figure B1 Package substrate width 34.95 35.05 mm Figure 2 B2 Package substrate length 34.95 35.05 mm Figure 2 C1 Die width 11.1 mm Figure 2 C2 Die length 8.2 mm Figure 2 F2 Die height (with underfill) 0.89 mm Figure 2 F3 Package overall height (package substrate to die) 2.022 Max mm Figure 2 G1 Width (first ball center to last ball center) 31.
Processor Thermal/Mechanical Information Figure 1.
Processor Thermal/Mechanical Information Figure 2. Micro-FCBGA Processor Package Drawing (Sheet 1 of 2) NOTE: 14 All dimensions in millimeters. Values shown are for reference only. See Table 1 for specific details.
Processor Thermal/Mechanical Information Figure 3. Micro-FCBGA Processor Package Drawing (Sheet 2 of 2) NOTE: All dimensions in millimeters. Values shown are for reference only. See Table 1 for specific details.
Processor Thermal/Mechanical Information 2.1.2 Heatsink Attach 2.1.2.1 General Guidelines The micro-FCBGA package may have capacitors placed in the area surrounding the processor die. The die-side capacitors, which are only slightly shorter than the die height, are electrically conductive and contact with electrically conductive materials should be avoided.
Processor Thermal/Mechanical Information depending on clip stiffness, the initial preload at beginning of life of the product may be significantly higher than the minimum preload that must be met throughout the life of the product. Refer to Appendix A for clip load metrology guidelines. 2.1.2.
Processor Thermal/Mechanical Information Figure 4. Vertical Lock-Down Alignment Feature Figure 5. 2.2 Various Types of Solder Crack Thermal Requirements The processor requires a thermal solution to maintain temperatures within operating limits. Refer to the datasheet for the processor thermal specifications.
Processor Thermal/Mechanical Information 2.2.1 Processor Junction Temperature Table 2. Thermal Specifications for Intel® Celeron® Processor 200 Sequence Symbol TDP Core Frequency and Voltage Cache Thermal Design Power (W) Notes 220 1.20 GHz 512 KB 19 1, 4, 5 Symbol Parameter TJ (°C) Junction Temperature NOTE: 1. 2. 3. 4. 5. 2.3 Processor Number Min Max Notes 0 °C 100 °C 3, 4 The TDP is not the maximum theoretical power the processor can generate. Not 100% tested.
Processor Thermal/Mechanical Information air, TA, and the local air velocity over the surface. The higher the air velocity over the surface, and the cooler the air, the more efficient is the resulting cooling. The nature of the airflow can also enhance heat transfer via convection. Turbulent flow can provide improvement over laminar flow. In the case of a heatsink, the surface exposed to the flow includes in particular the fin faces and the heatsink base.
Processor Thermal/Mechanical Information 2.3.2 Heatsink Mass With the need to push air cooling to better performance, heatsink solutions tend to grow larger (increase in fin surface) resulting in increased mass. The insertion of highly thermally conductive materials like copper to increase heatsink thermal conduction performance results in even heavier solutions. As mentioned in Section 2.1.
Processor Thermal/Mechanical Information 2.4 System Thermal Solution Considerations 2.4.1 Chassis Thermal Design Capabilities The reference thermal solution for the Intel Celeron processor 200 sequence on the Intel Desktop Board D201GLY2 is a passive heatsink design, which requires chassis to deliver sufficient airflow cooling to ensure stability and reliability of processor.
Processor Thermal/Mechanical Information By analyzing airflow condition in an μATX chassis, a case study in Figure 6 shows that a chassis layout is critical to components cooling in the system. The alignment of system fan (80×80mm2) with power supply fan results in pass-through airflow which bypasses the motherboard region. The cooling airflow from external environment is not able to reach motherboard region to cool critical components on the motherboard.
Processor Thermal/Mechanical Information Figure 7. Case Study #2: Relocate System Fan to CAG Venting for Airflow Improvement Figure 8.
Processor Thermal/Mechanical Information Figure 9. Case Study #4: A “Top Mount Fan” PSU is located next to Processor in μATX Chassis for System Thermal Performance Improvement 2.4.3 Summary In summary, heatsink design considerations for the Intel Celeron processor 200 sequence on the Intel Desktop Board D201GLY2 include: • The heatsink temperature TS-TOP-MAX which is a function of system thermal performance must be compliant in order to ensure processor reliability.
Processor Thermal/Mechanical Information 26 Thermal and Mechanical Design Guidelines
Thermal Metrology 3 Thermal Metrology This section discusses guidelines for testing thermal solutions, including measuring processor temperatures. In all cases, the thermal engineer must measure power dissipation and temperature to validate a thermal solution. To define the performance of a thermal solution the “thermal characterization parameter”, Ψ (“psi”) will be used. 3.
Thermal Metrology For reference thermal solution of Intel Celeron processor 200 sequence on Intel Desktop Board D201GLY2, the junction-to-local ambient thermal characterization parameter of the processor, ΨJA, is comprised of ΨJS, the thermal interface material thermal characterization parameter, ΨHS_BASE the thermal characterization parameter of the heatsink base from bottom center of heatsink base to top center of heatsink base surface, and of ΨS-TOP-A, the sink-to-local ambient thermal characterization
Thermal Metrology Figure 10 illustrates the combination of the different thermal characterization parameters. Figure 10. Processor Thermal Characterization Parameter Relationships TA TS-TOP ΨS-TOP-A ΨHS 3.1.1 BASE TIM ΨJS TJ Example The cooling performance, ΨJA, is then defined using the principle of thermal characterization parameter described above: • The junction temperature processor datasheet.
Thermal Metrology To determine the required heatsink performance, a heatsink solution provider would need to determine ΨJS performance for the selected TIM and mechanical load configuration. If the heatsink solution were designed to work with a TIM material performing at ΨJS ≤ 0.50 °C/W, solving for Equation 3 from above, the performance of the heatsink would be: ΨSA = ΨJA − ΨJS = 1.75 − 0.50 = 1.25 °C/W The heatsink temperature requirement can be obtained from Equation 4.
Thermal Metrology measurements will reveal a highly non-uniform temperature distribution across the inlet fan section. For passive heatsinks, thermocouples should be placed approximately 3 mm away from the heatsink as shown in Figure 12. Note: Testing an active heatsink with a variable speed fan can be done in a thermal chamber to capture the worst-case thermal environment scenarios.
Thermal Metrology Figure 12. Locations for Measuring Local Ambient Temperature, Passive Heatsink 3MM AWAY FROM HEATSINK SIDES HALF OF HEATSINK FIN HEIGHT SIDE VIEW POTISTION THERMOCOUPLES (X4) AT LOCATIONS AS INDICATED TO MEASURE TA. TC2 TC1 TC3 TC4 NOTE: TOP VIEW Drawing Not to Scale It is recommended that full and routine calibration of temperature measurement equipment be performed before attempting to perform temperature measurement.
Thermal Metrology 3.3.1 Sample Preparation In order to accurately measure the processor power consumption, it is required to attach sense resistor and replace one of the motherboard resistors. Schematic diagram in Figure 13 illustrates the precision resistor (RSENSE) attached in series with processor circuitry. The processor power consumption can be estimated by Equation 5.
Thermal Metrology Figure 13. Precision Resistor Connected in-series with Processor Circuitry for Power Measurement Figure 14.
Thermal Metrology Figure 15. Probing Resistance of the Soldered Walsin Resistor (R =19.6 KΩ) on Intel® Desktop Board D201GLY2 to Ensure Proper Attachment Figure 16.
Thermal Metrology 36 Thermal and Mechanical Design Guidelines
System Thermal/Mechanical Design Information 4 System Thermal/Mechanical Design Information 4.1 Overview of the Reference Design This chapter will document the requirements for designing a passive heatsink that meets the maximum usage power consumption that mentioned in Section 2.4. The Intel® Boxed Processor thermal solution E21953-001 satisfies the specified thermal requirements. Note: The part number E21953-001 provided in this document is for reference only.
System Thermal/Mechanical Design Information 4.2 Environmental Reliability Testing 4.2.1 Structural Reliability Testing Structural reliability tests consist of unpackaged, board-level vibration and shock tests of a given thermal solution in the assembled state. The thermal solution should meet the specified thermal performance targets after these tests are conducted; however, the test conditions outlined here may differ from your own system requirements. 4.2.1.
System Thermal/Mechanical Design Information Figure 18. Shock Acceleration Curve A c c e l e r a t i o n (g) 60 50 40 30 20 10 0 0 2 4 6 8 10 12 Time (m illiseconds) 4.2.1.2.1 Recommended Test Sequence Each test sequence should start with components (i.e. motherboard, heatsink assembly, etc.) that have never been previously submitted to any reliability testing. The test sequence should always start with a visual inspection after assembly, and BIOS/CPU/Memory test (refer to Section 4.2.1.2.
System Thermal/Mechanical Design Information 4.2.2 Power Cycling Thermal performance degradation due to TIM degradation is evaluated using power cycling testing. The test is defined by 7500 cycles for the heatsink temperature from room temperature (~23 ºC) to TS-TOP-MAX at usage power consumption. 4.2.3 Recommended BIOS/CPU/Memory Test Procedures This test is to ensure proper operation of the product before and after environmental stresses, with the thermal mechanical enabling components assembled.
System Thermal/Mechanical Design Information 4.4 Safety Requirements Heatsink and attachment assemblies shall be consistent with the manufacture of units that meet the safety standards: • UL Recognition-approved for flammability at the system level. All mechanical and thermal enabling components must be a minimum UL94V-2 approved. • CSA Certification. All mechanical and thermal enabling components must have CSA certification.
System Thermal/Mechanical Design Information 42 Thermal and Mechanical Design Guidelines
Heatsink Clip Load Metrology Appendix A Heatsink Clip Load Metrology A.1 Overview The primary objective of the preload measurement is to ensure the preload designed into the retention mechanism is able to meet minimum of 8.7lbf at end-of-line and does not violate the maximum specifications of the package. A.2 Test Preparation A.2.1 Heatsink Preparation The following components are required to validate a generic z-clip solution: A.2.2 1.
Heatsink Clip Load Metrology Table 5. Typical Test Equipment 7. Item 20. Load cell 21. Notes: 1, 5 18. Description 22. Honeywell*-Sensotec* Model 13 subminiature load cells, compression only 9. Part Number (Model) 25. AL322BL 23. Select a load range depending on load level being tested. 24. www.sensotec.com 26. Data Logger (or scanner ) 28. Vishay* Measurements Group Model 6100 scanner with a 6010A strain card (one card required per channel). 29. Model 6100 32.
Heatsink Clip Load Metrology A.3 Test Procedure Examples The following procedure is for a generic z-clip solution using the clip force time0 measurement machine at room temperature: 1. Install anchors onto top plate. Anchor can be secured using epoxy or glue. 2. Fasten top plate onto the clip force measurement machine. Place package simulator on top of the preload cell as well. 3. Place the heatsink (remove any TIM material) on top of the package simulator.
Heatsink Clip Load Metrology Figure 20.
Intel® Enabled Boxed Processor Thermal Solution Information Appendix B Intel® Enabled Boxed Processor Thermal Solution Information This appendix includes supplier information for Intel enabled vendors. Table 6 lists suppliers that produce Intel® Boxed Processor thermal solution E21953001 components. The part numbers listed below identifies these reference components. End-users are responsible for the verification of the Intel enabled component offerings with the supplier.
Intel® Enabled Boxed Processor Thermal Solution Information 48 Thermal and Mechanical Design Guidelines
Mechanical Drawings Appendix C Mechanical Drawings The following table lists the mechanical drawings included in this appendix. These drawings refer to the reference thermal mechanical enabling components for the processor. Note: Intel reserves the right to make changes and modifications to the design as necessary. 49. Drawing Description 50. Page Number 51. Motherboard Keep-out Footprint Definition and Height Restrictions for Enabling Components 52. 50 53. Reference Clip E21952-001 54. 51 55.
Mechanical Drawings Figure 21.
Mechanical Drawings Figure 22.
Mechanical Drawings Figure 23.
Mechanical Drawings Figure 24.
