Product Data Sheet / Brochure
Table Of Contents
- 1 Product Description
- 1.1 Overview
- 1.2 Online Support
- 1.3 Processor
- 1.4 System Memory
- 1.5 Processor Graphics Subsystem
- 1.5.1 Integrated Graphics
- 1.5.1.1 Intel® Ultra High Definition (Intel® UHD) Graphics
- 1.5.1.2 Video Memory Allocation
- 1.5.1.3 High Definition Multimedia Interface* (HDMI*)
- 1.5.1.4 DisplayPort* via USB Type-C
- 1.5.1.5 Multiple DisplayPort and HDMI Configurations
- 1.5.1.6 High-bandwidth Digital Content Protection (HDCP)
- 1.5.1.7 Integrated Audio Provided by the HDMI and USB Type C Interfaces
- 1.5.1 Integrated Graphics
- 1.6 USB
- 1.7 SATA Interface
- 1.8 Thunderbolt 3
- 1.9 Real-Time Clock Subsystem
- 1.10 Audio Subsystem†
- 1.11 LAN Subsystem
- 1.12 Hardware Management Subsystem
- 1.13 Power Management
- 1.14 Intel Platform Security Technologies
- 2 Technical Reference
- 2.1 Memory Resources
- 2.2 Connectors and Headers
- 2.2.1 Front Panel Connectors
- 2.2.2 Back Panel Connectors
- 2.2.3 Headers and Connectors (Top)
- 2.2.4 Connectors and Headers (Bottom)
- 2.2.4.1 Signal Tables for the Connectors and Headers
- 2.2.4.2 Add-in Card Connectors
- 2.2.4.3
- 2.2.4.4 USB Type C connector
- 2.2.4.5 Front Panel Header (2.0 mm Pitch)
- 2.2.4.6 SDXC Card Reader
- 2.2.4.7 Power Supply Connector
- 2.2.4.8 Internal USB 2.0 Single-Port Header (1.25 mm Pitch)
- 2.2.4.9 Consumer Infrared (CIR) Sensor
- 2.2.4.10 Consumer Electronics Control (CEC) Header
- 2.2.4.11 RGB LED
- 2.2.4.12 Digital Microphone Array†
- 2.3 BIOS Security Jumper
- 2.4 Mechanical Considerations
- 2.5 Electrical Considerations
- 2.6 Thermal Considerations
- 2.7 Reliability
- 2.8 Environmental
- 3 Overview of BIOS Features
- 4 Error Messages and Blink Codes
- 5 Intel NUC Kit Features
Technical Reference
42
2.7 Reliability
The Mean Time between Failures (MTBF) predictions are calculated using component and
subassembly random failure rates. The calculation is based on the Telcordia SR-332, Issue 2,
Method I, Case 3, 55 ºC ambient. The MTBF prediction is used to estimate repair rates and spare
parts requirements. The MTBF for Intel NUC10i3FNB board is 273,271 hours. The MTBF for Intel
NUC10i5FNB board is 273,153 hours. The MTBF for Intel NUC10i7FNB board is 272,416 hours.
2.8 Environmental
Table 33 lists the environmental specifications for the board.
Table 33. Environmental Specifications
Parameter Specification
Temperature
Non-Operating -40 °C to +60 °C
Operating (Board)
0
°
C to +50
°
C
The operating temperature of the board may be determined by measuring the air
temperature from the junction of the heatsink fins and fan, next to the attachment screw,
in a closed chassis, while the system is in operation.
Operating (System)
0
°
C to +35
°
C
Shock (Board)
Unpackaged 50 g trapezoidal waveform
Velocity change of 170 inches/s²
Packaged
Free fall package drop machine set to the height determined by the weight of the package.
Product Weight (pounds)
Free Fall (inches)
<20 36
21-40
30
41-80
24
81-100
18
Vibration (System)
Unpackaged
5 Hz to 20 Hz: 0.001 g²/Hz sloping up to 20 Hz @ 0.01 g²/Hz
20 Hz to 500 Hz: 0.01 g²/Hz (flat)
Input acceleration is 2.20 g RMS
Packaged 5 Hz to 40 Hz: 0.015 g²/Hz (flat)
40 Hz to 500 Hz: 0.015 g²/Hz sloping down to 0.00015 g²/Hz
Input acceleration is 1.09 g RMS
Acoustic
Cool Setting 4.5 BA (~35dBA)
100% duty (@3400
RPM)
5.7BA (~47dBA)
Note: Before attempting to operate this board, the overall temperature of the board must be above the minimum
operating temperature specified. It is recommended that the board temperature be at least room temperature
before attempting to power on the board. The operating and non-operating environment must avoid condensing
humidity.