Product Data Sheet / Brochure
Table Of Contents
- 1 Product Description
- 1.1 Overview
- 1.2 Online Support
- 1.3 Processor
- 1.4 System Memory
- 1.5 Processor Graphics Subsystem
- 1.5.1 Integrated Graphics
- 1.5.1.1 Intel® Ultra High Definition (Intel® UHD) Graphics
- 1.5.1.2 Video Memory Allocation
- 1.5.1.3 High Definition Multimedia Interface* (HDMI*)
- 1.5.1.4 DisplayPort* via USB Type-C
- 1.5.1.5 Multiple DisplayPort and HDMI Configurations
- 1.5.1.6 High-bandwidth Digital Content Protection (HDCP)
- 1.5.1.7 Integrated Audio Provided by the HDMI and USB Type C Interfaces
- 1.5.1 Integrated Graphics
- 1.6 USB
- 1.7 SATA Interface
- 1.8 Thunderbolt 3
- 1.9 Real-Time Clock Subsystem
- 1.10 Audio Subsystem†
- 1.11 LAN Subsystem
- 1.12 Hardware Management Subsystem
- 1.13 Power Management
- 1.14 Intel Platform Security Technologies
- 2 Technical Reference
- 2.1 Memory Resources
- 2.2 Connectors and Headers
- 2.2.1 Front Panel Connectors
- 2.2.2 Back Panel Connectors
- 2.2.3 Headers and Connectors (Top)
- 2.2.4 Connectors and Headers (Bottom)
- 2.2.4.1 Signal Tables for the Connectors and Headers
- 2.2.4.2 Add-in Card Connectors
- 2.2.4.3
- 2.2.4.4 USB Type C connector
- 2.2.4.5 Front Panel Header (2.0 mm Pitch)
- 2.2.4.6 SDXC Card Reader
- 2.2.4.7 Power Supply Connector
- 2.2.4.8 Internal USB 2.0 Single-Port Header (1.25 mm Pitch)
- 2.2.4.9 Consumer Infrared (CIR) Sensor
- 2.2.4.10 Consumer Electronics Control (CEC) Header
- 2.2.4.11 RGB LED
- 2.2.4.12 Digital Microphone Array†
- 2.3 BIOS Security Jumper
- 2.4 Mechanical Considerations
- 2.5 Electrical Considerations
- 2.6 Thermal Considerations
- 2.7 Reliability
- 2.8 Environmental
- 3 Overview of BIOS Features
- 4 Error Messages and Blink Codes
- 5 Intel NUC Kit Features
Technical Reference
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2.6 Thermal Considerations
CAUTION
A chassis with a maximum temperature of 50
o
C at the processor fan inlet is recommended. If the
internal ambient temperature exceeds 50
o
C, further thermal testing is required to ensure
components do not exceed their maximum case temperature.
CAUTION
Failure to ensure appropriate airflow may result in reduced performance of both the processor
and/or voltage regulator or, in some instances, damage to the board.
All responsibility for determining the adequacy of any thermal or system design remains solely
with the system integrator. Intel makes no warranties or representations that merely following the
instructions presented in this document will result in a system with adequate thermal
performance.
CAUTION
Ensure that the ambient temperature does not exceed the board’s maximum operating
temperature. Failure to do so could cause components to exceed their maximum case
temperature and malfunction. For information about the maximum operating temperature, see
the environmental specifications in Section 2.8.
CAUTION
Ensure that proper airflow is maintained in the processor voltage regulator circuit. Failure to do
so may result in shorter than expected product lifetime.