Product Data Sheet / Brochure
Table Of Contents
- 1 Product Description
- 1.1 Overview
- 1.2 Online Support
- 1.3 Processor
- 1.4 System Memory
- 1.5 Processor Graphics Subsystem
- 1.5.1 Integrated Graphics
- 1.5.1.1 Intel® Ultra High Definition (Intel® UHD) Graphics
- 1.5.1.2 Video Memory Allocation
- 1.5.1.3 High Definition Multimedia Interface* (HDMI*)
- 1.5.1.4 DisplayPort* via USB Type-C
- 1.5.1.5 Multiple DisplayPort and HDMI Configurations
- 1.5.1.6 High-bandwidth Digital Content Protection (HDCP)
- 1.5.1.7 Integrated Audio Provided by the HDMI and USB Type C Interfaces
- 1.5.1 Integrated Graphics
- 1.6 USB
- 1.7 SATA Interface
- 1.8 Thunderbolt 3
- 1.9 Real-Time Clock Subsystem
- 1.10 Audio Subsystem†
- 1.11 LAN Subsystem
- 1.12 Hardware Management Subsystem
- 1.13 Power Management
- 1.14 Intel Platform Security Technologies
- 2 Technical Reference
- 2.1 Memory Resources
- 2.2 Connectors and Headers
- 2.2.1 Front Panel Connectors
- 2.2.2 Back Panel Connectors
- 2.2.3 Headers and Connectors (Top)
- 2.2.4 Connectors and Headers (Bottom)
- 2.2.4.1 Signal Tables for the Connectors and Headers
- 2.2.4.2 Add-in Card Connectors
- 2.2.4.3
- 2.2.4.4 USB Type C connector
- 2.2.4.5 Front Panel Header (2.0 mm Pitch)
- 2.2.4.6 SDXC Card Reader
- 2.2.4.7 Power Supply Connector
- 2.2.4.8 Internal USB 2.0 Single-Port Header (1.25 mm Pitch)
- 2.2.4.9 Consumer Infrared (CIR) Sensor
- 2.2.4.10 Consumer Electronics Control (CEC) Header
- 2.2.4.11 RGB LED
- 2.2.4.12 Digital Microphone Array†
- 2.3 BIOS Security Jumper
- 2.4 Mechanical Considerations
- 2.5 Electrical Considerations
- 2.6 Thermal Considerations
- 2.7 Reliability
- 2.8 Environmental
- 3 Overview of BIOS Features
- 4 Error Messages and Blink Codes
- 5 Intel NUC Kit Features
Power Management
14
1.13.1.1 System States and Power States
Under ACPI, the operating system directs all system and device power state transitions. The
operating system puts devices in and out of low-power states based on user preferences and
knowledge of how devices are being used by applications. Devices that are not being used can be
turned off. The operating system uses information from applications and user settings to put the
system as a whole into a low-power state.
Table 10 lists the power states supported by the board along with the associated system power
targets. See the ACPI specification for a complete description of the various system and power
states.
Table 10. Power States and Targeted System Power
Global States
Sleeping States
Processor
States
Device States
Targeted System
Power
(Note 1)
G0 – working
state
S0 – working
C0 – working
D0 – working state.
Full power > 30 W
G1 – sleeping
state
S3 – Suspend to RAM.
Context saved to
RAM.
No power
D3 – no power
except for wake-up
logic.
Power < 5 W
(Note 2)
G1 – sleeping
state
S4 – Suspend to disk.
Context saved to disk.
No power D3 – no power
except for wake-up
logic.
Power < 5 W
(Note 2)
G2/S5
S5 – Soft off. Context
not saved. Cold boot
is required.
No power
D3 – no power
except for wake-up
logic.
Power < 5 W
(Note 2)
G3 – mechanical
off
AC power is
disconnected
from the
computer.
No power to the
system.
No power
D3 – no power for
wake-up logic,
except when
provided by battery
or external source.
No power to the system.
Service can be performed
safely.
Notes:
1. Total system power is dependent on the system configuration, including add-in boards and peripherals powered by
the system chassis’ power supply.
2. Dependent on the standby power consumption of wake-up devices used in the system.