Product Data Sheet / Brochure
Table Of Contents
- 1 Product Description
- 1.1 Overview
- 1.2 Online Support
- 1.3 Processor
- 1.4 System Memory
- 1.5 Processor Graphics Subsystem
- 1.5.1 Integrated Graphics
- 1.5.1.1 Intel® Ultra High Definition (Intel® UHD) Graphics
- 1.5.1.2 Video Memory Allocation
- 1.5.1.3 High Definition Multimedia Interface* (HDMI*)
- 1.5.1.4 DisplayPort* via USB Type-C
- 1.5.1.5 Multiple DisplayPort and HDMI Configurations
- 1.5.1.6 High-bandwidth Digital Content Protection (HDCP)
- 1.5.1.7 Integrated Audio Provided by the HDMI and USB Type C Interfaces
- 1.5.1 Integrated Graphics
- 1.6 USB
- 1.7 SATA Interface
- 1.8 Thunderbolt 3
- 1.9 Real-Time Clock Subsystem
- 1.10 Audio Subsystem†
- 1.11 LAN Subsystem
- 1.12 Hardware Management Subsystem
- 1.13 Power Management
- 1.14 Intel Platform Security Technologies
- 2 Technical Reference
- 2.1 Memory Resources
- 2.2 Connectors and Headers
- 2.2.1 Front Panel Connectors
- 2.2.2 Back Panel Connectors
- 2.2.3 Headers and Connectors (Top)
- 2.2.4 Connectors and Headers (Bottom)
- 2.2.4.1 Signal Tables for the Connectors and Headers
- 2.2.4.2 Add-in Card Connectors
- 2.2.4.3
- 2.2.4.4 USB Type C connector
- 2.2.4.5 Front Panel Header (2.0 mm Pitch)
- 2.2.4.6 SDXC Card Reader
- 2.2.4.7 Power Supply Connector
- 2.2.4.8 Internal USB 2.0 Single-Port Header (1.25 mm Pitch)
- 2.2.4.9 Consumer Infrared (CIR) Sensor
- 2.2.4.10 Consumer Electronics Control (CEC) Header
- 2.2.4.11 RGB LED
- 2.2.4.12 Digital Microphone Array†
- 2.3 BIOS Security Jumper
- 2.4 Mechanical Considerations
- 2.5 Electrical Considerations
- 2.6 Thermal Considerations
- 2.7 Reliability
- 2.8 Environmental
- 3 Overview of BIOS Features
- 4 Error Messages and Blink Codes
- 5 Intel NUC Kit Features
Audio Subsystem / LAN Subsystem
11
1.11.4 Wireless Network Module
The Intel® Wi-Fi 6 AX201 module provides hi-speed wireless connectivity with the following
capabilities:
• Compliant with IEEE 802.11a/b/g/n/ac/ax, 802.11d, 802.11e, 802.11h, 802.11i, 802.11w,
802.11r, 802.11k specifications
• Wi-Fi CERTIFIED* a/b/g/n/ac with wave 2 features, WMM*, WMM-PS*, WPA*, WPA2*, WPS2*
• Maximum bandwidth of 2.4 Gbps
• Dual Mode Bluetooth® 5
• Downlink MU-MIMO
• 2x2: two Transmit and two Receive streams
• 160 MHz channels (2.4 GHz, 5 GHz)
• Supports new features such as OFDMA, 1024QAM, Target Wake Time (TWT), spatial reuse
• Seamless roaming between access points
• OS support for Microsoft Windows* 10, Linux*
• Wi-Fi Direct* encryption and authentication (Microsoft Windows only): WPA2-PSK, AES-CCMP
• Wi-Fi Miracast* as Source, Protected Management Frames
• Security Features
• Security methods: WPA*, WPA2*, and WPA3* (pending OS support)
• Authentication protocols: 802.1X, EAP-TLS, EAP-TTLS, PEAPv0 (EAP-SIM, EAP-AKA PAP,
EAP-AKA’), MS-CHAPv2
• Encryption: 64-bit and 128-bit WEP, TKIP, 128-bit AES-CCMP, 256-bit AES-GCMP
For information about
Refer to
Obtaining WLAN software and drivers
http://downloadcenter.intel.com
Full Specifications
http://intel.com/wireless
1.12 Hardware Management Subsystem
The board has several hardware management features, including thermal and voltage monitoring.
1.12.1 Hardware Monitoring
The hardware monitoring and fan control subsystem is based on an ITE Tech. IT5571 embedded
controller, which supports the following:
• Processor and system ambient temperature monitoring
• Chassis fan speed monitoring
• Voltage monitoring of CPU IO Vcc (+Vccio), Memory Vcc (V_SM), CPU IN Vcc (+Vccp)
• SMBus interface
1.12.2 Fan Monitoring
Fan monitoring can be implemented using third-party software.
1.12.3 Thermal Solution
Figure 7 shows the location of the thermal solution and processor fan header.