Product Data Sheet / Brochure
Table Of Contents
- 1 Product Description
- 1.1 Overview
- 1.2 Online Support
- 1.3 Processor
- 1.4 System Memory
- 1.5 Processor Graphics Subsystem
- 1.5.1 Integrated Graphics
- 1.5.1.1 Intel® Ultra High Definition (Intel® UHD) Graphics
- 1.5.1.2 Video Memory Allocation
- 1.5.1.3 High Definition Multimedia Interface* (HDMI*)
- 1.5.1.4 DisplayPort* via USB Type-C
- 1.5.1.5 Multiple DisplayPort and HDMI Configurations
- 1.5.1.6 High-bandwidth Digital Content Protection (HDCP)
- 1.5.1.7 Integrated Audio Provided by the HDMI and USB Type C Interfaces
- 1.5.1 Integrated Graphics
- 1.6 USB
- 1.7 SATA Interface
- 1.8 Thunderbolt 3
- 1.9 Real-Time Clock Subsystem
- 1.10 Audio Subsystem†
- 1.11 LAN Subsystem
- 1.12 Hardware Management Subsystem
- 1.13 Power Management
- 1.14 Intel Platform Security Technologies
- 2 Technical Reference
- 2.1 Memory Resources
- 2.2 Connectors and Headers
- 2.2.1 Front Panel Connectors
- 2.2.2 Back Panel Connectors
- 2.2.3 Headers and Connectors (Top)
- 2.2.4 Connectors and Headers (Bottom)
- 2.2.4.1 Signal Tables for the Connectors and Headers
- 2.2.4.2 Add-in Card Connectors
- 2.2.4.3
- 2.2.4.4 USB Type C connector
- 2.2.4.5 Front Panel Header (2.0 mm Pitch)
- 2.2.4.6 SDXC Card Reader
- 2.2.4.7 Power Supply Connector
- 2.2.4.8 Internal USB 2.0 Single-Port Header (1.25 mm Pitch)
- 2.2.4.9 Consumer Infrared (CIR) Sensor
- 2.2.4.10 Consumer Electronics Control (CEC) Header
- 2.2.4.11 RGB LED
- 2.2.4.12 Digital Microphone Array†
- 2.3 BIOS Security Jumper
- 2.4 Mechanical Considerations
- 2.5 Electrical Considerations
- 2.6 Thermal Considerations
- 2.7 Reliability
- 2.8 Environmental
- 3 Overview of BIOS Features
- 4 Error Messages and Blink Codes
- 5 Intel NUC Kit Features
Audio Subsystem / LAN Subsystem
9
Pin Number
Pin Name
Description
1
Tip
Left Audio Out
2
Ring
Right Audio Out
3
Ring
Common/Ground
4
Sleeve
Audio In/MIC
Figure 5. 4-Pin 3.5 mm (1/8 inch) Audio Jack Pin Out
NOTE
The analog circuit of the front panel audio connector is designed to power headphones or
amplified speakers only. Poor audio quality occurs if passive (nonamplified) speakers are
connected to this output.
†
DMIC header and audio jack appear on select models only. See Board and Product Identification
pages in the foreword section.
1.10.1 Audio Subsystem Software
Audio software and drivers are available from Intel’s web site.
For information about
Refer to
Obtaining Audio software and drivers
http://downloadcenter.intel.com
1.11 LAN Subsystem
The LAN subsystem consists of the following:
• Intel I219V Gigabit Ethernet Controller (10/100/1000 Mbps)
• RJ-45 LAN connector with integrated status LEDs
Additional features of the LAN subsystem include:
• CSMA/CD protocol engine
• LAN connect interface between the Processor and the LAN controller
• Power management capabilities
ACPI technology support
LAN wake capabilities
• LAN subsystem software
1.11.1 Intel® I219V Gigabit Ethernet Controller
The Intel I219V Gigabit Ethernet Controller supports the following features:
• Compliant with the 1 Gbps Ethernet 802.3, 802.3u, 802.3z, 802.3ab specifications