Intel® NUC Products NUC10i3FN/NUC10i5FN/ NUC10i7FN Technical Product Specification Regulatory Models: NUC10FNK (Slim Kit/Mini PC) NUC10FNH (Tall Kit/Mini PC) NUC10FNB (Board) Apr 2021 Rev 003
Intel NUC Products NUC10i3FN, NUC10i5FN and NUC10i7FN may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current characterized errata, if any, are documented in Intel NUC Products NUC10i3FN/NUC10i5FN/NUC10i7FN Specification Update.
Foreword Foreword Note: For this Technical Product Specification, the use of Intel NUC Products NUC10i3FN/NUC10i5FN/NUC10i7FN refers to Intel NUC 10 Performance Kit NUC10i3FNH, Intel NUC 10 Performance Kit NUC10i5FNH, Intel NUC 10 Performance Kit NUC10i7FNH, Intel NUC 10 Performance Kit NUC10i3FNK, Intel NUC 10 Performance Kit NUC10i5FNK, Intel NUC 10 Performance Kit NUC10i7FNK, Intel NUC 10 Performance Mini PC NUC10i3FNKx, Intel NUC 10 Performance Mini PC NUC10i5FNKx, Intel NUC 10 Performance Mini PC NUC1
Foreword Basic Intel® NUC Board NUC10i7FNB Identification Information AA Revision BIOS Revision Notes K51823-xxx FNCML357.vvvv.yyyy.dddd.tttt 1,2,4 M38062-xxx FNCML357.vvvv.yyyy.dddd.tttt 1,2,3,4 Notes: iv 1. Where, v = version, y = year, d = date, t = time 2. The AA number is found on a small label on the SO-DIMM sockets. 3. No audio codec. 4.
Foreword Product Identification Information Intel® NUC Products NUC10i3FN/NUC10i5FN/NUC10i7FN Identification Information Product Name Intel® NUC Board AA# Differentiating Features NUC10i3FNK Kit with power adapter, “Intel® NUC 10 Performance kit” NUC10i3FNH HDD-capable kit with power adapter, “Intel® NUC 10 Performance kit” NUC10i3FNHF6 NUC10i3FNHFA NUC10i3FNB K51826-xxx NUC10i3FNHJA HDD kit with power adapter, 16GB Intel® Optane™ Module, 1TB HDD, 4GB DDR4-2666 SDRAM[1], “Intel® NUC 10 Performanc
Foreword Specification Changes or Clarifications The table below indicates the Specification Changes or Specification Clarifications that apply to the Intel NUC Products NUC10i3FN, NUC10i5FN and NUC10i7FN.
Preface Preface This Technical Product Specification (TPS) specifies the board layout, components, connectors, power and environmental requirements, and the BIOS for Intel® NUC Board NUC10i3FNB, Intel® NUC Board NUC10i5FNB and Intel® NUC Board NUC10i7FNB.
Preface Other Common Notation viii # Used after a signal name to identify an active-low signal (such as USBP0#) GB Gigabyte (1,073,741,824 bytes) Gb Gigabit (1,073,741,824 bits) GBps Gigabytes per second Gbps Gigabits per second KB Kilobyte (1024 bytes) Kb Kilobit (1024 bits) KBps 1000 bytes per second Kbps 1000 bits per second MB Megabyte (1,048,576 bytes) Mb Megabit (1,048,576 bits) MBps Megabytes per second Mbps Megabits per second TDP Thermal Design Power Xxh An address o
Contents Contents Revision History ............................................................................................................... ii Disclaimer .................................................................................................................................................................. ii Board Identification Information.....................................................................................................................
Contents 1.12.2 Fan Monitoring........................................................................................................................ 11 1.12.3 Thermal Solution ................................................................................................................... 11 1.13 Power Management ................................................................................................................................ 12 1.13.1 ACPI ................................................
Contents 4 Error Messages and Blink Codes ......................................................................... 50 4.1 4.2 Front-panel Power LED Blink Codes ................................................................................................ 50 BIOS Error Messages............................................................................................................................... 50 5 Intel NUC Kit Features .........................................................................
Contents Figures Figure 1. Major Board Components (Top) .......................................................................................................... 3 Figure 2. Major Board Components (Bottom) ................................................................................................... 4 Figure 3. Block Diagram.............................................................................................................................................. 6 Figure 4.
Contents Table 14. SATA Data/Power Connector (0.5 mm pitch ZIF) ..................................................................... 25 Table 15. Single-Port Internal USB 2.0 Header (1.25 mm pitch) ........................................................... 25 Table 16. M.2 2280 Module (key type M) Connector .................................................................................. 25 Table 17. Digital Microphone (DMIC) Array Connector (1.25 mm Pitch) † ..........................................
Product Description 1 Product Description 1.1 Overview 1.1.1 Feature Summary Table 1 summarizes the major features of Intel® NUC Board NUC10i3FNB, Intel® NUC Board NUC10i5FNB and Intel® NUC Board NUC10i7FNB. Table 1. Feature Summary Form Factor 4.0 inches by 4.0 inches (101.60 millimeters by 101.60 millimeters) Processor • A soldered-down 10th generation Intel® Core™ i3-10110U dual-core processor with a maximum 25 W TDP, 2.1 GHz base, 4.
Product Description Table 1. Feature Summary (continued) Peripheral Interfaces • USB 3.1 (Gen 2/10 Gbps) Type C ports: • • One port is implemented via the external front panel Type C connector One port is implemented via the external back panel Type C connector • USB 3.1 (Gen 2/10 Gbps) Type A ports: • • One port is implemented via the external front panel connectors (blue) Two ports are implemented via the external back panel connectors (blue) • USB 2.
Product Description 1.1.2 Board Layout (Top) Figure 1 shows the location of the major components on the top-side of Intel NUC Board NUC10i3FNB, Intel NUC Board NUC10i5FNB and Intel NUC Board NUC10i7FNB. Figure 1. Major Board Components (Top) NOTE Actual thermal solution may differ from picture. Table 2 lists the components identified in Figure 1. Table 2.
Product Description 1.1.3 Board Layout (Bottom) Figure 2 shows the location of the major components on the bottom-side of Intel NUC Board NUC10i3FNB, Intel NUC Board NUC10i5FNB and Intel NUC Board NUC10i7FNB. Figure 2.
Product Description Table 3. Components Shown in Figure 2 Item from Figure 2 Description A DC Input Jack B HDMI connector C LAN connector D Dual USB 3.1 ports (blue) E Digital Microphone (DMIC) header† F Front Panel header G Coin Cell Battery connector H RGB LED header I Intel® Wi-Fi 6 + Bluetooth 5 AX201 module J Standby LED K M.2 connector (key type M) for 2242 and 2280 modules L Single-port USB 2.0 header (1.
Product Description 1.1.4 Block Diagram Figure 3 is a block diagram of the major functional areas of the board. Figure 3. Block Diagram NOTE DMIC header and audio jack appear on select models only. See Board and Product Identification pages in the foreword section.
Online Support 1.2 Online Support To find information about… Visit this Intel web site: Intel NUC Board NUC10i3FNB, Intel NUC http://www.intel.com/NUC Board NUC10i5FNB, and Intel NUC Board NUC10i7FNB Intel NUC Support http://www.intel.com/NUCSupport Available configurations for Intel NUC Board NUC10i3FNB, Intel NUC Board NUC10i5FNB and Intel NUC Board NUC10i7FNB http://ark.intel.com Intel® NUC 10 Performance kit NUC10i3FNH https://www.intel.com/content/www/us/en/support/products/195506.
Online Support Tested memory, compatible peripherals and components http://compatibleproducts.intel.com/ Integration information http://www.intel.com/NUCSupport Processor datasheet http://ark.intel.com Regulatory documentation https://www.intel.com/content/www/us/en/support/articles/000055305.html CAUTION Disconnect the attached power cord before you open or service the device.
Processor / System Memory 1.3 Processor One of the following: A soldered-down 10th generation Intel® Core™ i3-10110U dual-core processor with up to a maximum 25 W TDP (if thermal margin is available). • • • • • 2.10 GHz base frequency, 4.10 GHz turbo frequency, 4 threads 4 MB Intel® Smart Cache Intel® UHD Graphics Integrated memory controller Integrated PCH A soldered-down 10th generation Intel® Core™ i5-10210U quad-core processor with up to a maximum 25 W TDP (if thermal margin is available).
System Memory NOTE To be fully compliant with all applicable DDR SDRAM memory specifications, the board should be populated with SO-DIMMs that support the Serial Presence Detect (SPD) data structure. This allows the BIOS to read the SPD data and program the chipset to accurately configure memory settings for optimum performance.
Processor Graphics Subsystem 1.5 Processor Graphics Subsystem The Intel NUC Boards NUC10i3FNB, NUC10i5FNB and NUC10i7FNB support graphics through Intel UHD Graphics. 1.5.1 Integrated Graphics The board supports integrated graphics via the processor. 1.5.1.1 Intel® Ultra High Definition (Intel® UHD) Graphics The Intel UHD graphics controller features the following: • • 9th-Generation Low Power (Gen 9 LP) architecture supports up to 48 Execution Units (EUs) API support Direct3D* 2015, Direct3D 11.
Processor Graphics Subsystem 1.5.1.3 High Definition Multimedia Interface* (HDMI*) HDMI is supported through a MegaChips MCDP2800-BCT DisplayPort 1.2a to HDMI 2.0b Level Shifter/Protocol Converter (LSPCON). The HDMI port supports standard, enhanced, or high definition video, plus multi-channel digital audio on a single cable. The port is compatible with all ATSC and DVB HDTV standards and supports eight full range channels at 24-bit/192 kHz audio of lossless audio formats.
Processor Graphics Subsystem 1.5.1.5 Multiple DisplayPort and HDMI Configurations Multiple DisplayPort and HDMI configurations feature the following: Single HDMI 2.0b with 4K @ 60 Hz support Single DisplayPort 1.
USB / SATA Interface 1.6 USB The USB port arrangement is as follows: • • USB 3.1 Gen 2 (10 Gbps) Type C ports (maximum power is 15W for the first connected device; 4.5W for the second connected device): One port is implemented via the external front panel Type C connector One port is implemented via the external back panel Type C connector USB 3.
SATA Interface 1.7.1 AHCI Mode The board supports AHCI storage mode. NOTE In order to use AHCI mode, AHCI must be enabled in the BIOS. Microsoft* Windows* 10 includes the necessary AHCI drivers without the need to install separate AHCI drivers during the operating system installation process; however, it is always good practice to update the AHCI drivers to the latest available by Intel. 1.7.
Thunderbolt 3 / Real-Time Clock Subsystem / Audio Subsystem 1.8 Thunderbolt 3 The boards support Thunderbolt™ 3 with up to 40 Gbps of data throughput, one 4k (60Hz) monitor output, USB3.1 (Gen 2) connection and charging capabilities up to 5V at 3A or 9v at 2A via the back-panel USB Type C connector. Item A in Figure 10 shows the location of the rear panel USB Type C port. 1.9 For information about Refer to Compatible Thunderbolt™ 3 devices https://www.intel.
Audio Subsystem / LAN Subsystem Pin Number Pin Name Description 1 2 3 4 Tip Ring Ring Sleeve Left Audio Out Right Audio Out Common/Ground Audio In/MIC Figure 5. 4-Pin 3.5 mm (1/8 inch) Audio Jack Pin Out NOTE The analog circuit of the front panel audio connector is designed to power headphones or amplified speakers only. Poor audio quality occurs if passive (nonamplified) speakers are connected to this output. DMIC header and audio jack appear on select models only.
LAN Subsystem / Power Management Multi-speed operation: 10/100/1000 Mbps Full-duplex operation at 10/100/1000 Mbps; Half-duplex operation at 10/100 Mbps Flow control support compliant with the 802.3X specification as well as the specific operation of asymmetrical flow control defined by 802.3z VLAN support compliant with the 802.
Audio Subsystem / LAN Subsystem 1.11.4 Wireless Network Module The Intel® Wi-Fi 6 AX201 module provides hi-speed wireless connectivity with the following capabilities: Compliant with IEEE 802.11a/b/g/n/ac/ax, 802.11d, 802.11e, 802.11h, 802.11i, 802.11w, 802.11r, 802.11k specifications Wi-Fi CERTIFIED* a/b/g/n/ac with wave 2 features, WMM*, WMM-PS*, WPA*, WPA2*, WPS2* Maximum bandwidth of 2.4 Gbps Dual Mode Bluetooth® 5 Downlink MU-MIMO 2x2: two Transmit and two Receive streams 160 MHz channels (2.
LAN Subsystem / Power Management Item Description A Thermal solution B Processor fan header Figure 7. Thermal Solution and Fan Header 1.13 Power Management Power management is implemented at several levels, including: • • Software support through Advanced Configuration and Power Interface (ACPI) Hardware support: Power Input Instantly Available PC technology LAN wake capabilities Wake from USB WAKE# signal wake-up support Wake from S5 Wake from CIR +5 V Standby Power Indicator LED • 1.13.
Power Management • • • • • • Plug and Play (including bus and device enumeration) Power management control of individual devices, add-in boards (some add-in boards may require an ACPI-aware driver), video displays, and hard disk drives Methods for achieving less than 15-watt system operation in the power-on/standby sleeping state A Soft-off feature that enables the operating system to power-off the computer Support for multiple wake-up events (see Table 11 on page 15) Support for a front panel power and s
Power Management 1.13.1.1 System States and Power States Under ACPI, the operating system directs all system and device power state transitions. The operating system puts devices in and out of low-power states based on user preferences and knowledge of how devices are being used by applications. Devices that are not being used can be turned off. The operating system uses information from applications and user settings to put the system as a whole into a low-power state.
Power Management 1.13.1.2 Wake-up Devices and Events Table 11 lists the devices or specific events that can wake the computer from specific states. Table 11.
Power Management 1.13.2.1 Power Input When resuming from an AC power failure, the computer returns to the power state it was in before power was interrupted (on or off). The computer’s response can be set using the Last Power State feature in the BIOS Setup program’s Boot menu. 1.13.2.2 Instantly Available PC Technology Instantly Available PC technology enables the board to enter the ACPI S3 (Suspend-to-RAM) sleep-state.
Power Management CAUTION If AC power has been switched off and the standby power indicator is still lit, disconnect the power cord before installing or removing any devices connected to the board. Failure to do so could damage the board and any attached devices. Figure 8.
Power Management 1.13.3 Microsoft Modern Standby Support Intel NUC Products NUC10i3FN/NUC10i5FN/NUC10i7FN support Windows* 10 Modern Standby, Microsoft’s implementation of ACPI low power S0 idle (aka, S0iX). This allows the system to reduce power consumption and only wake when necessary, as for system maintenance tasks or user intervention. Modern Standby is required for Wake-on-Voice capability. NOTES You cannot switch between ACPI S3 and Modern Standby.
Platform Security 1.14.2 Intel® Platform Trust Technology Intel® Platform Trust Technology (Intel® PTT) is a platform functionality for credential storage and key management. Intel® PTT supports Microsoft* BitLocker* Drive Encryption for hard drive encryption and supports all Microsoft requirements for firmware Trusted Platform Module (fTPM) 2.0 for client computers. NOTE Support for fTPM version 2.0 requires a UEFI-enabled operating system, such as Microsoft* Windows* 10.
Technical Reference 2 Technical Reference 2.1 Memory Resources 2.1.1 Addressable Memory The board utilizes a maximum of 64 GB of addressable system memory. Typically, the address space that is allocated for PCI Conventional bus add-in cards, PCI Express configuration space, BIOS (SPI Flash device), and chipset overhead resides above the top of DRAM (total system memory).
Technical Reference This section describes the board’s connectors and headers. The connectors and headers can be divided into these groups: • • 2.2.1 Front panel I/O connectors Back panel I/O connectors Front Panel Connectors Figure 9 shows the location of the front panel connectors for the board. Item Description A Front panel power button and LED B Front panel Stereo microphone/headphone jack† C USB 3.1 (Gen 2) Type A port (blue) D USB 3.1 (Gen 2) Type C port E HDD LED F CIR Figure 9.
Technical Reference 2.2.3 Headers and Connectors (Top) Figure 11 shows the location of the headers and connectors on the top-side of the board. Figure 11. Headers and Connectors (Top) Table 12 lists the headers and connectors identified in Figure 11. Table 12.
Technical Reference 2.2.4 Connectors and Headers (Bottom) Figure 12 shows the locations of the connectors and headers on the bottom-side of the board. Figure 12.
Technical Reference Table 13 lists the connectors and headers identified in Figure 12. Table 13. Connectors and Headers Shown in Figure 12 Item from Figure 12 Description A Digital microphone array connector† B Front panel header C Coin battery connector D RGB LED connector E M.2 connector (key type M) for 2242 and 2280 modules F Front panel single-port USB 2.0 header (1.25 mm pitch) G Front panel single-port USB 2.0 header (1.25 mm pitch) H SATA data/power connector (0.
Technical Reference 2.2.4.1 Signal Tables for the Connectors and Headers Table 14. SATA Data/Power Connector (0.5 mm pitch ZIF) Pin Signal Name Pin Signal Name 1 +5 V 2 +5 V 3 +5 V 4 +5 V 5 NC 6 NC 7 NC 8 DEVSLP 9 GND 10 GND 11 SATA_RX_P 12 SATA_RX_N 13 GND 14 SATA_TX_N 15 SATA_TX_P 16 GND NOTE Connector is Entery 6700K-J16N-00L, FPC 16 pin 0.5mm pitch SMT. Table 15. Single-Port Internal USB 2.0 Header (1.
Technical Reference Table 16. M.2 2280 Module (key type M) Connector (continued) Pin Signal Name Pin Signal Name 54 PEWAKE# (I/O)(0/3.3V) or N/C 55 REFCLKP 52 CLKREQ# (I/O)(0/3.3V) or N/C 53 REFCLKN 50 PERST# (O)(0/3.
Technical Reference NOTES Connector is Aces part number 50273-0047C-002, 1.25 mm pitch header, surface mount, vertical, lead-free, 4 circuits. DMIC array connector appears on select models only. See Board and Product Identification pages in the foreword section. † Table 18. RGB LED Connector (1.25 mm Pitch) Pin Signal Name 1 +3VSB 2 Red HDD LED 3 Green HDD LED 4 Blue HDD LED See section 2.2.4.11 for more information on the RGB LED connector.
Technical Reference 2.2.4.4 USB Type C connector The board has several features that are supported via the USB Type C connector. • Supports USB 3.1 Gen 2.0 Maximum bandwidth is approximately 10 Gbps • Supports Display port 1.2 Maximum bandwidth is approximately 17.28 Gbps • Supports Thunderbolt 3 PCIe x4 connection (rear connector only) Maximum bandwidth is approximately 40 Gbps Table 20.
Technical Reference Figure 13. Connection Diagram for Front Panel Header (2.0 mm Pitch) 2.2.4.5.1 Hard Drive Activity LED Pins Pins 1 and 3 can be connected to an LED to provide a visual indicator that data is being read from or written to a hard drive. Proper LED function requires a SATA hard drive or optical drive connected to an onboard SATA connector. 2.2.4.5.2 Reset Switch Pins Pins 5 and 7 can be connected to a momentary single pole, single throw (SPST) type switch that is normally open.
Technical Reference 2.2.4.5.4 Power Switch Pins Pins 6 and 8 can be connected to a front panel momentary-contact power switch. The switch must pull the SW_ON# pin to ground for at least 50 ms to signal the power supply to switch on or off. (The time requirement is due to internal debounce circuitry on the board.) At least two seconds must pass before the power supply will recognize another on/off signal. 2.2.4.
Technical Reference 2.2.4.7.1 Power Sensing Circuit The board has a power sensing circuit that: • • Manages CPU power usage to maintain system power consumption below 90 W (NUC10i3FN and NUC10i5FN) or below 120 W (NUC10i7FN). Designed for use with 90 W AC-DC adapters (NUC10i3FN and NUC10i5FN) and 120 W AC-DC adapters (NUC10i7FN). 2.2.4.8 Internal USB 2.0 Single-Port Header (1.25 mm Pitch) Figure 14 is a connection diagram for the internal USB header.
Technical Reference 2.2.4.10 Consumer Electronics Control (CEC) Header The board contains two mutually-exclusive methods for controlling HDMI CEC devices: • External CEC adaptor connected via CEC connector (item J in Figure 12; pinout in Table 19) • Onboard CEC control from the embedded controller via HDMI cable and BIOS setup. Expected behavior is provided in Table 25 below. Table 25.
Technical Reference 2.2.4.12 Digital Microphone Array† The digital microphone array consists of four front facing digital microphones located on along the topside of the front panel to minimize acoustic interference. The digital microphone array is intended to be used with a digital assistant like Microsoft’s Cortana* and supports both near-field and far-field use cases. Item A in Figure 12 shows the location of the digital microphone array connector.
Technical Reference Table 27. BIOS Security Jumper Settings Function/Mode Jumper Setting Configuration Normal 1-2 The BIOS uses current configuration information and passwords for booting. Lockdown 2-3 The BIOS uses current configuration information and passwords for booting, except: • All POST Hotkeys are suppressed (prompts are not displayed and keys are not accepted. For example, F2 for Setup, F10 for the Boot Menu). • Power Button Menu is not available (see Section 3.7.4 Power Button Menu).
Technical Reference 2.4 Mechanical Considerations 2.4.1 Form Factor The board is designed to fit into a custom chassis. Figure 17 illustrates the mechanical form factor for the board. Dimensions are given in inches [millimeters]. Figure 17.
Technical Reference Figure 18 shows the height dimensions of the board. Figure 18. Board Height Dimensions 2.4.2 Weights & Dimensions Table 28 lists select weights of boards and kits and Table 29 lists kit dimensions. Table 28. Select Weights Item Weight (in kg) Board with Thermal Solution 0.21 Slim Kit (includes Board Assembly) 0.47 Tall NUC10i7FNH Kit (includes Board Assembly) 0.7 Table 29.
Technical Reference 2.6 Thermal Considerations CAUTION A chassis with a maximum temperature of 50 oC at the processor fan inlet is recommended. If the internal ambient temperature exceeds 50 oC, further thermal testing is required to ensure components do not exceed their maximum case temperature. CAUTION Failure to ensure appropriate airflow may result in reduced performance of both the processor and/or voltage regulator or, in some instances, damage to the board.
Technical Reference Figure 19 shows the locations of the localized high temperature zones. Item Description A Thermal solution B Processor voltage regulator area Figure 19.
Technical Reference A thermal pad has been installed for the bottom of the chassis to improve the thermal performance when using M.2 devices that operate at higher temperatures. If the thermal pad ever needs to be replaced, Figure 20 shows the installation area of the thermal pad for Intel NUC Kit NUC10i3FNK, Intel NUC Kit NUC10i5FNK and Intel NUC Kit NUC10i7FNK. Item Description A Thermal Pad B Thermal Pad Installation Area Figure 20.
Technical Reference Figure 21 shows the installation area of the thermal pad for Intel NUC Kit NUC10i3FNH, Intel NUC Kit NUC10i5FNH and Intel NUC Kit NUC10i7FNH. Item Description A Thermal Pad B Thermal Pad Installation Area Figure 21. Installation area of Thermal Pad for Intel NUC Kits NUC10i3FNH/NUC10i5FNH/NUC10i7FNH CAUTION Disconnect the attached power cord before you open or service the device.
Technical Reference Table 31 provides maximum case temperatures for the components that are sensitive to thermal changes. The operating temperature, current load, or operating frequency could affect case temperatures. Maximum case temperatures are important when considering proper airflow to cool the board. Table 31.
Technical Reference 2.7 Reliability The Mean Time between Failures (MTBF) predictions are calculated using component and subassembly random failure rates. The calculation is based on the Telcordia SR-332, Issue 2, Method I, Case 3, 55 ºC ambient. The MTBF prediction is used to estimate repair rates and spare parts requirements. The MTBF for Intel NUC10i3FNB board is 273,271 hours. The MTBF for Intel NUC10i5FNB board is 273,153 hours. The MTBF for Intel NUC10i7FNB board is 272,416 hours. 2.
BIOS Features 3 Overview of BIOS Features 3.1 Introduction The board uses Intel BIOS that is stored in the Serial Peripheral Interface Flash Memory (SPI Flash) and can be updated using a disk-based program. The SPI Flash contains the Visual BIOS Setup program, POST, the PCI auto-configuration utility, embedded controller (EC) firmware, LAN EEPROM information, and Plug and Play support. The BIOS displays a message during POST identifying the type of BIOS and a revision code.
BIOS Features to install an operating system that supports USB. By default, Legacy USB support is set to Enabled. Legacy USB support operates as follows: 1. When you first apply power to the computer, legacy support is disabled. 2. POST begins. 3. Legacy USB support is enabled by the BIOS allowing you to use a USB keyboard to enter and configure the BIOS Setup program and the maintenance menu. 4. POST completes. 5. The operating system loads.
BIOS Features 3.6 BIOS Recovery It is unlikely that anything will interrupt a BIOS update; however, if an interruption occurs, the BIOS could be damaged. Table 34 lists the drives and media types that can and cannot be used for BIOS recovery. The BIOS recovery media does not need to be made bootable. Table 34.
BIOS Features 3.7 Boot Options In the BIOS Setup program, the user can choose to boot from a hard drive, optical drive, removable drive, or the network. The default setting is for the optical drive to be the first boot device, the hard drive second, removable drive third, and the network fourth. NOTE Optical drives are not supported by the onboard SATA connectors. Optical drives are supported only via the USB interfaces. If the optical drive is not bootable, it will be ignored during the POST process.
BIOS Features 3.7.4 Power Button Menu As an alternative to normal POST Hotkeys, the user can use the power button to access a menu. The Power Button Menu is accessible via the following sequence: 1. System is in S4/S5 (soft off); will not work if system is in G3 (after “no power” state) 2. User pushes the power button and holds it down for 3 seconds 3. The front panel power button LED will change from blue to amber then the user can release the power button. 4.
BIOS Features 3.8 Hard Disk Drive Password Security Feature The Hard Disk Drive Password Security feature blocks read and write accesses to the hard disk drive until the correct password is given. Hard Disk Drive Passwords are set in BIOS SETUP and are prompted for during BIOS POST. For convenient support of S3 resume, the system BIOS will automatically unlock drives on resume from S3. Valid password characters are A-Z, a-z, and 0-9. Passwords may be up to 19 characters in length.
BIOS Features 3.9 BIOS Security Features The BIOS includes security features that restrict access to the BIOS Setup program and who can boot the computer. A supervisor password and a user password can be set for the BIOS Setup program and for booting the computer, with the following restrictions: • • • • • • • • The supervisor password gives unrestricted access to view and change all the Setup options in the BIOS Setup program. This is the supervisor mode.
Error Messages & Blink Codes 4 Error Messages and Blink Codes 4.1 Front-panel Power LED Blink Codes Whenever a recoverable error occurs during POST, the BIOS causes the board’s front panel power LED to blink an error message describing the problem (see Table 38). Table 38. Front-panel Power LED Blink Codes 4.2 Type Pattern Note Power-on Solid on primary color. Indicates S0 state. Default to On; can be disabled via BIOS Setup S3 Standby Blink alternate color .25 seconds on, .
Intel NUC Kit Features 5 Intel NUC Kit Features 5.1 Chassis Front Panel Features See the Product Identification Information section on page v to identify Intel NUC Boards and their respective kit or system. Figure 22 and Figure 23 show the location of the features located on or near the front of the chassis. Figure 22. Intel NUC Kit NUC10i3FNH/NUC10i5FNH/NUC10i7FNH Features – Front Table 40 lists the components identified in Figure 22. Table 40.
Intel NUC Kit Features Figure 23. Intel NUC Kit NUC10i3FNK/NUC10i5FNK/NUC10i7FNK Features – Front Table 41 lists the components identified in Figure 23. Table 41. Components Shown in Figure 23 Item from Figure 23 Description SDXC Card Reader Digital Microphone Array† Power Switch and Power LED Consumer Infrared Sensor Speaker/Headset Jack† USB 3.1 Gen2 Type A (right) and Type C (left) Connectors Kensington* Anti-Theft Key Lock Hole NOTE DMIC array and audio jack appear on select models only.
Intel NUC Kit Features 5.2 Chassis Rear Panel Features Figure 24 and Figure 25 show the location of the features located on the rear of the chassis. Figure 24. Intel NUC Kit NUC10i3FNH/NUC10i5FNH/NUC10i7FNH Features – Rear Table 42 lists the components identified in Figure 24. Table 42. Components Shown in Figure 24 Item from Figure 24 Description 19V DC Power Inlet Cooling Vents Thunderbolt™ 3 via USB Type C connector USB 3.
Intel NUC Kit Features Figure 25. Intel NUC Kit NUC10i3FNK/NUC10i5FNK/NUC10i7FNK Features – Rear Table 43 lists the components identified in Figure 25. Table 43. Components Shown in Figure 25 Item from Figure 25 Description Cooling Vents Thunderbolt™ 3 via USB Type C connector USB 3.
Intel NUC Kit Features 5.3 VESA Bracket Installation Figure 26 shows installation of the VESA bracket (included with Intel® NUC 10 Performance kits only). Figure 26.
