Data Sheet

Datasheet, Volume 1 of 2 87
Thermal Management
5 Thermal Management
5.1 Processor Thermal Management
The thermal solution provides both component-level and system-level thermal
management. To allow optimal operation and long-term reliability of Intel processor-
based systems, the system/processor thermal solution should be designed so that the
processor:
• Bare Die Parts: Remains below the maximum junction temperature (Tj
MAX
)
specification at the maximum thermal design power (TDP).
• Lidded Parts: Remains below the maximum case temperature (Tcmax) specification
at the maximum thermal design power.
• Conforms to system constraints, such as system acoustics, system skin-
temperatures, and exhaust-temperature requirements.
Caution: Thermal specifications given in this chapter are on the component and package level
and apply specifically to the processor. Operating the processor outside the specified
limits may result in permanent damage to the processor and potentially other
components in the system.
5.1.1 Thermal Considerations
The processor TDP is the maximum sustained power that should be used for design of
the processor thermal solution. TDP is a power dissipation and component temperature
operating condition limit, specified in this document, that is validated during
manufacturing for the base configuration when executing a near worst case
commercially available workload without AVX as specified by Intel for the SKU
segment. TDP may be exceeded for short periods of time or if running a very high
power workload.
To allow the optimal operation and long-term reliability of Intel processor-based
systems, the processor must remain within the minimum and maximum component
temperature specifications. For lidded parts, the appropriate case temperature (TCASE)
specifications is defined by the applicable thermal profile. For bare die parts the
component temperature specification is the applicable Tj_max.
Thermal solutions not designed to provide this level of thermal capability may affect the
long-term reliability of the processor and system.
The processor integrates multiple processing IA cores, graphics cores and for some
SKUs a PCH, or a PCH and EDRAM, on a single package.This may result in power
distribution differences across the package and should be considered when designing
the thermal solution.
Intel
®
Turbo Boost Technology 2.0 allows processor IA cores to run faster than the base
frequency. It is invoked opportunistically and automatically as long as the processor is
conforming to its temperature, voltage, power delivery and current control limits. When
Intel
®
Turbo Boost Technology 2.0 is enabled: