Data Sheet

Datasheet, Volume 1 of 2 5
4.5 Direct Media Interface (DMI) Power Management................................................... 83
4.6 Processor Graphics Power Management ................................................................ 83
4.6.1 Memory Power Savings Technologies ........................................................ 83
4.6.2 Display Power Savings Technologies ......................................................... 83
4.6.3 Processor Graphics Core Power Savings Technologies .................................. 85
4.7 System Agent Enhanced Intel
®
Speedstep
®
Technology .........................................85
4.8 Voltage Optimization.......................................................................................... 86
4.9 ROP (Rest Of Platform) PMIC .............................................................................. 86
5 Thermal Management .............................................................................................. 87
5.1 Processor Thermal Management .......................................................................... 87
5.1.1 Thermal Considerations........................................................................... 87
5.1.2 Intel
®
Turbo Boost Technology 2.0 Power Monitoring .................................. 88
5.1.3 Intel
®
Turbo Boost Technology 2.0 Power Control ....................................... 88
5.1.4 Configurable TDP (cTDP) and Low-Power Mode........................................... 90
5.1.5 Thermal Management Features ................................................................ 92
5.1.6 Intel
®
Memory Thermal Management ........................................................ 97
5.2 H/U-Processor Line Thermal and Power Specifications ............................................ 99
5.3 S-Processor Line Thermal and Power Specifications.............................................. 100
5.3.1 Fan Speed Control Scheme with Digital Thermal Sensor (DTS) 2.0 .............. 103
6 Signal Description ................................................................................................. 105
6.1 System Memory Interface................................................................................. 105
6.2 PCI Express* Graphics (PEG) Signals ................................................................. 108
6.3 Direct Media Interface (DMI) Signals.................................................................. 108
6.4 Reset and Miscellaneous Signals ........................................................................ 109
6.5 embedded DisplayPort* (eDP*) Signals .............................................................. 110
6.6 Display Interface Signals .................................................................................. 110
6.7 Processor Clocking Signals................................................................................ 111
6.8 Testability Signals ........................................................................................... 111
6.9 Error and Thermal Protection Signals ................................................................. 112
6.10 Power Sequencing Signals ................................................................................ 112
6.11 Processor Power Rails ...................................................................................... 113
6.12 Ground, Reserved and Non-Critical to Function (NCTF) Signals .............................. 114
6.13 Processor Internal Pull-Up/Pull-Down Terminations .............................................. 115
7 Electrical Specifications ......................................................................................... 116
7.1 Processor Power Rails ..................................................................................... 116
7.1.1 Power and Ground Pins ......................................................................... 116
7.1.2 V
CC
Voltage Identification (VID) ............................................................. 116
7.2 DC Specifications............................................................................................. 117
7.2.1 Processor Power Rails DC Specifications .................................................. 117
7.2.2 Processor Interfaces DC Specifications .................................................... 127
8 Package Mechanical Specifications ........................................................................ 133
8.1 Package Mechanical Attributes .......................................................................... 133
8.2 Package Loading Specifications ......................................................................... 133
8.3 Package Storage Specifications ......................................................................... 134
Figures
1-1 S/H-Processor Line Platforms ................................................................................... 11
1-2 U-Processor Line Platform........................................................................................ 12
2-1 Intel
®
Flex Memory Technology Operations ............................................................... 24
2-2 Interleave (IL) and Non-Interleave (NIL) Modes Mapping............................................. 27
2-3 PCI Express* Related Register Structures in the Processor ........................................... 31