Data Sheet

ManualsBrandsIntel ManualsCPU ProcessorsCore i7-9700KF 3.6 GHz Eight-Core LGA 1151 Processor

4 Datasheet, Volume 1 of 2

2.5.5 High-Definition Multimedia Interface (HDMI*)............................................ 46

2.5.6 Digital Video Interface (DVI) ................................................................... 47

2.5.7 embedded DisplayPort* (eDP*) ............................................................... 47

2.5.8 Integrated Audio.................................................................................... 47

2.5.9 Multiple Display Configurations (Dual Channel DDR) ................................... 48

2.5.10 Multiple Display Configurations (Single Channel DDR) ................................. 49

2.5.11 High-bandwidth Digital Content Protection (HDCP) ..................................... 49

2.5.12 Display Link Data Rate Support................................................................ 50

2.5.13 Display Bit Per Pixel (BPP) Support........................................................... 51

2.5.14 Display Resolution per Link Width ............................................................ 51

2.6 Platform Environmental Control Interface (PECI) ................................................... 51

2.6.1 PECI Bus Architecture............................................................................. 51

3 Technologies........................................................................................................... 54

3.1 Intel

Virtualization Technology (Intel

VT) ......................................................... 54

3.1.1 Intel

Virtualization Technology (Intel

VT) for IA-32, Intel

64 and Intel

Architecture (Intel

VT-X)....................................................................... 54

3.1.2 Intel

Virtualization Technology (Intel

VT) for Directed I/O (Intel

VT-d).... 56

3.2 Security Technologies........................................................................................ 59

3.2.1 Intel

Trusted Execution Technology (Intel

TXT) ...................................... 59

3.2.2 Intel

Advanced Encryption Standard New Instructions (Intel

AES-NI) ........ 60

3.2.3 PCLMULQDQ (Perform Carry-Less Multiplication Quad Word) Instruction........ 60

3.2.4 Intel

Secure Key .................................................................................. 60

3.2.5 Execute Disable Bit ................................................................................ 61

3.2.6 Boot Guard Technology........................................................................... 61

3.2.7 Intel

Supervisor Mode Execution Protection (SMEP) .................................. 61

3.2.8 Intel

Supervisor Mode Access Protection (SMAP) ...................................... 61

3.2.9 Intel

Memory Protection Extensions (Intel

MPX)..................................... 62

3.2.10 Intel

Software Guard Extensions (Intel

SGX) ......................................... 62

3.2.11 Intel

Virtualization Technology (Intel

VT) for Directed I/O (Intel

VT-d).... 63

3.3 Power and Performance Technologies .................................................................. 63

3.3.1 Intel

Hyper-Threading Technology (Intel

HT Technology) ........................ 63

3.3.2 Intel

Turbo Boost Technology 2.0........................................................... 63

3.3.3 Intel

Thermal Velocity Boost (TVB)......................................................... 64

3.3.4 Intel

Advanced Vector Extensions 2 (Intel

AVX2).................................... 64

3.3.5 Intel

64 Architecture x2APIC ................................................................. 65

3.3.6 Power Aware Interrupt Routing (PAIR)...................................................... 66

3.3.7 Intel

Transactional Synchronization Extensions (Intel

TSX-NI) ................. 66

3.4 Debug Technologies .......................................................................................... 66

3.4.1 Intel

Processor Trace ........................................................................... 66

4 Power Management ................................................................................................ 67

4.1 Advanced Configuration and Power Interface (ACPI) States Supported ..................... 69

4.2 Processor IA Core Power Management ................................................................. 71

4.2.1 OS/HW Controlled P-states...................................................................... 71

4.2.2 Low-Power Idle States............................................................................ 72

4.2.3 Requesting Low-Power Idle States ........................................................... 73

4.2.4 Processor IA Core C-State Rules .............................................................. 73

4.2.5 Package C-States................................................................................... 75

4.2.6 Package C-States and Display Resolutions................................................. 78

4.3 Integrated Memory Controller (IMC) Power Management........................................ 79

4.3.1 Disabling Unused System Memory Outputs................................................ 79

4.3.2 DRAM Power Management and Initialization .............................................. 79

4.3.3 DDR Electrical Power Gating (EPG) ........................................................... 81

4.3.4 Power Training ...................................................................................... 82

4.4 PCI Express* Power Management ....................................................................... 82