Data Sheet

Datasheet, Volume 1 of 2 17
Introduction
NCTF
Non-Critical to Function. NCTF locations are typically redundant ground or non-
critical reserved balls/lands, so the loss of the solder joint continuity at end of life
conditions will not affect the overall product functionality.
OPC On-Package Cache
PCH
Platform Controller Hub. The chipset with centralized platform capabilities including
the main I/O interfaces along with display connectivity, audio features, power
management, manageability, security, and storage features. The PCH may also be
referred as “chipset”.
PECI Platform Environment Control Interface
PEG PCI Express Graphics
PL1, PL2, PL3 Power Limit 1, Power Limit 2, Power Limit 3
Processor The 64-bit multi-core component (package)
Processor Core
The term “processor core” refers to Si die itself, which can contain multiple
execution cores. Each execution core has an instruction cache, data cache, and 256-
KB L2 cache. All execution cores share the LLC.
Processor Graphics Intel Processor Graphics
PSR Panel Self-Refresh
Rank
A unit of DRAM corresponding to four to eight devices in parallel, ignoring ECC.
These devices are usually, but not always, mounted on a single side of a SODIMM.
SCI System Control Interrupt. SCI is used in the ACPI protocol.
SDP Scenario Design Power.
SGX Software Guard Extension
SHA Secure Hash Algorithm
SSC Spread Spectrum Clock
Storage Conditions
A non-operational state. The processor may be installed in a platform, in a tray, or
loose. Processors may be sealed in packaging or exposed to free air. Under these
conditions, processor landings should not be connected to any supply voltages, have
any I/Os biased, or receive any clocks. Upon exposure to “free air” (that is, unsealed
packaging or a device removed from packaging material), the processor should be
handled in accordance with moisture sensitivity labeling (MSL) as indicated on the
packaging material.
STR Suspend to RAM
TAC Thermal Averaging Constant
TCC Thermal Control Circuit
TDP Thermal Design Power
TOB Tolerance Budget
TTV TDP Thermal Test Vehicle TDP
V
CC
Processor core power supply
V
CCGT
Processor Graphics Power Supply
V
CCIO
I/O Power Supply
V
CCSA
System Agent Power Supply
V
CCST
Vcc Sustain Power Supply
V
DDQ
DDR Power Supply
VLD Variable Length Decoding
VPID Virtual Processor ID
V
SS
Processor Ground
Table 1-2. Terminology (Sheet 3 of 3)
Term Description