Data Sheet

Datasheet, Volume 1 of 2 15
Introduction
External Thermal Sensor (TS-on-DIMM and TS-on-Board)
Render Thermal Throttling
Fan speed control with DTS
Intel Turbo Boost Technology 2.0 Power Control
Refer to Chapter 5,
“Thermal Management” for more information.
1.5 Package Support
The processor is available in the following packages:
A 46 mm x 24 mm BGA package (BGA1528) for U-Processor Line
A 42 mm x 28 mm BGA package (BGA1440) for H-Processor Line
A 37.5 mm x 37.5 mm LGA package (LGA1151) for S-Processor Line
1.6 Ballout Information
Refer to the Related Documents section for document information.
1.7 Processor Testability
An XDP on-board connector is warmly recommended to enable full debug capabilities.
For the processor SKUs, a merged XDP connector is highly recommended to enable
lower C-state debug.
Note: When separ
ate XDP connectors will be used at C8–C10 states, the processor will need
to be waked up using the PCH.
The processor includes boundary-scan for board and system level testability.
1.8 Operating System Support
Processor Line
Windows* 10
64-bit
OS X Linux* OS Chrome* OS
S-processor line
H-processor line
U-processor line
1.9 Terminology
Yes Yes Yes No
Yes Yes Yes No
Yes Yes No No
Table 1-2. Terminology (Sheet 1 of 3)
Term Description
4K Ultra High Definition (UHD)
AES Advanced Encryption Standard
AGC Adaptive Gain Control
BLT Block Level Transfer