Data Sheet

Maximum Static
Normal Load
Limit
Minimum PCB Thickness
Assumptions
Notes
Notes:
Package Mechanical Specifications
134 Datasheet, Volume 1 of 2
8.3 Package Storage Specifications
Parameter Description Min Max Notes
T
ABSOLUTE STORAGE
The non-operating device storage temperature.
Damage (latent or otherwise) may occur when
subjected to this temperature for any length of
time in Intel Original sealed moisture barrier bag
and / or box.
T
SUSTAINED STORAGE
The ambient storage temperature limit (in
shipping media) for the sustained period of time
as specified below in Intel Original sealed
moisture barrier bag and / or box.
RH
SUSTAINED STORAGE
The maximum device storage relative humidity
for the sustained period of time as specified
below in Intel Original sealed moisture barrier
bag and / or box.
TIME
SUSTAINED STORAGE
Maximum time: associated with customer shelf
life in Intel Original sealed moisture barrier bag
and / or box.
Notes:
§ §
Table 8-2. Package Loading Specifications
U-Processor Line 67 N (15 lbf) 0.8 mm 1, 2, 3
H-Processor Line
67 N (15 lbf) 1.0 mm 1, 2, 3
111 N (25 lbf) 1.0 mm 1, 2, 3, 4
1. The thermal solution attach mechanism should not induce continuous stress to the package. It may only
apply a uniform load to the die to maintain a thermal interface.
2.
This specification applies to the uniform compressive load in the direction perpendicular to the dies’ top
surface. Load should be centered on processor die center.
3. This specification is based on limited testing for design characterization.
4. This load limit assumes the use of a backing plate.
Table 8-3. Package Storage Specifications
-25 °C 125 °C 1, 2, 3
-5 °C 40 °C 1, 2, 3
60% @ 24 °C 1, 2, 3
NA
Moisture
Sensitive
Devices:
60 months
from bag
seal date;
Non-
moisture
sensitive
devices:
60 months
from lot
date
1, 2, 3
1. TABSOLUTE STORAGE applies to the un-assembled component only and does not apply to the shipping
media, moisture barrier bags or desiccant. R
efers to a component device that is not assembled in a board
or socket that is not to be electrically connected to a voltage reference or I/O signals.
2. Specified temperatures are based on data collected. Exceptions for surface mount re-flow are specified
by applicable JEDEC J-STD-020 and MAS documents. The JEDEC, J-STD-020 moisture level rating and
associated handling practices apply to all moisture sensitive de-vices removed from moisture barrier bag.
3. Post board attach storage temperature limits are not specified for non-Intel branded boards. Consult your
board manufacturer for storage specifications