Data Sheet

Datasheet, Volume 1 of 2 133
Package Mechanical Specifications
8 Package Mechanical
Specifications
8.1 Package Mechanical Attributes
The U and H-Processor Line use a Flip Chip technology available in a Ball Grid Array
(BGA) package. The S-Processor Line uses a Flip Chip technology available in Land Grid
Array (LGA). The following table provides an overview of the mechanical attributes of
the package.
8.2
Package Parameter
U-Processor
Line
H-Processor
Line
S-Processor
Line
4-Core/2-Core
GT3+OPC
6-Core GT2
8-Core/6-Core / 4-
Core GT2
Package
Technology
Package Type
Interconnect
Lead Free
Halogenated
Flame
R
etardant Free
Package
Configur
ation
Solder Ball
Composition
Ball/Pin Count
Grid Array
P
attern
Land Side
Capacitors
Die Side
Capacitors
Die
Configur
ation
Package
Dimensions
Nominal
P
ackage Size
Min Ball/Pin
pitch
Package Loading Specifications
Table 8-1. Package Mechanical Attributes
Flip Chip Ball Grid
Array
Flip Chip Ball Grid
Array
Flip Chip Land Grid
Array
Ball Grid Array
(BGA)
Ball Grid Arr
ay
(BGA)
Land Grid Array
(LGA)
Yes Yes N/A
Yes Yes Yes
SAC405 SAC405 N/A
1528 1440 1151
Balls Anywhere Balls Anywhere Grid Array
Yes Yes Yes
No Yes Yes No
3 Dice MCP
1 Die
Single-Chip
P
ackage
1 Die
Single-Chip Package
with IHS
46x24 mm 42x28 mm
37.5x37.5 mm
0.65 mm 0.65 mm
0.914 mm