Data Sheet

Electrical Specifications
130 Datasheet, Volume 1 of 2
7.2.2.5 embedded DisplayPort* (eDP*) DC Specification
7.2.2.6 CMOS DC Specifications
7.2.2.7 GTL and OD DC Specifications
ZTX-DIFF-DC DC Differential Tx Impedance 80 100 120 
Notes:
1. Vcc
IO
depends on segment.
2. V
OL
and V
OH
levels depends on the level chosen by the Platform.
Table 7-18. embedded DisplayPort* (eDP*) Group DC Specifications
Symbol Parameter Min Typ Max Units
V
OL
eDP_DISP_UTIL Output Low Voltage — — 0.1*V
CCIO
V
V
OH
eDP_DISP_UTIL Output High Voltage 0.9*Vcc
IO
—— V
R
UP
eDP_DISP_UTIL Internal pull-up 100 — — 
R
DOWN
eDP_DISP_UTIL Internal pull-down 100 — — 
eDP_RCOMP eDP resistance compensation 24.75 25 25.25 
ZTX-DIFF-DC DC Differential Tx Impedance 80 100 120 
Notes:
1. COMP resistance is to VCOMP_OUT.
2. eDP_RCOMP resistor should be provided on the system board.
Table 7-19. CMOS Signal Group DC Specifications
Symbol Parameter Min Max Units Notes
1
V
IL
Input Low Voltage — Vcc * 0.3 V 2, 5
V
IH
Input High Voltage Vcc * 0.7 — V 2, 4, 5
V
OL
Output Low Voltage — Vcc * 0.1 V 2
V
OH
Output High Voltage Vcc * 0.9 — V 2, 4
R
ON
Buffer on Resistance 23 73  -
I
LI
Input Leakage Current — ±150 A 3
Notes:
1. Unless otherwise noted, all specifications in this table apply to all processor frequencies.
2. The Vcc referred to in these specifications refers to instantaneous Vcc levels.
3. For VIN between “0” V and Vcc Measured when the driver is tri-stated.
4. V
IH
and V
OH
may experience excursions above Vcc. However, input signal drivers should comply with the signal quality
specifications.
5. N/A
Table 7-20. GTL Signal Group and Open Drain Signal Group DC Specifications (Sheet 1 of
2)
Symbol Parameter Min Max Units Notes
1
V
IL
Input Low Voltage (TAP, except PROC_TCK,
PROC_TRST#)
— Vcc * 0.6 V 2, 5, 6
Table 7-17. Digital Display Interface Group DC Specifications (DP/HDMI*) (Sheet 2 of 2)
Symbol Parameter Min Typ Max Units Notes
1