Specification Sheet

Datasheet, Volume 1 of 2 5
4.5 Direct Media Interface (DMI) Power Management................................................... 83
4.6 Processor Graphics Power Management ................................................................ 83
4.6.1 Memory Power Savings Technologies ........................................................ 83
4.6.2 Display Power Savings Technologies ......................................................... 83
4.6.3 Processor Graphics Core Power Savings Technologies .................................. 85
4.7 System Agent Enhanced Intel
®
Speedstep
®
Technology ......................................... 85
4.8
®
Voltage Optimization ....................................................................................... 86
4.9 ROP (Rest Of Platform) PMIC .............................................................................. 86
5 Thermal Management .............................................................................................. 87
5.1 Processor Thermal Management .......................................................................... 87
5.1.1 Thermal Considerations........................................................................... 87
5.1.2 Intel
®
Turbo Boost Technology 2.0 Power Monitoring .................................. 88
5.1.3 Intel
®
Turbo Boost Technology 2.0 Power Control ....................................... 88
5.1.4 Configurable TDP (cTDP) and Low-Power Mode........................................... 90
5.1.5 Thermal Management Features ................................................................ 92
5.1.6 Intel
®
Memory Thermal Management ........................................................ 97
5.2 All-Processor Line Thermal and Power Specifications .............................................. 98
5.3 HU-Processor Line Thermal and Power Specifications.............................................. 99
5.4 S-Processor Line Thermal and Power Specifications.............................................. 101
5.4.1 Thermal Profile for PCG 2015D Processor................................................. 104
5.4.2 Thermal Profile for PCG 2015C Processor ................................................. 105
5.4.3 Thermal Profile for PCG 2015B Processor ................................................. 106
5.4.4 Thermal Metrology ............................................................................... 107
5.4.5 Fan Speed Control Scheme with Digital Thermal Sensor (DTS) 1.1 .............. 107
5.4.6 Fan Speed Control Scheme with Digital Thermal Sensor (DTS) 2.0 .............. 109
6 Signal Description ................................................................................................. 111
6.1 System Memory Interface................................................................................. 111
6.2 PCI Express* Graphics (PEG) Signals ................................................................. 114
6.3 Direct Media Interface (DMI) Signals.................................................................. 114
6.4 Reset and Miscellaneous Signals ........................................................................ 115
6.5 embedded DisplayPort* (eDP*) Signals .............................................................. 116
6.6 Display Interface Signals .................................................................................. 116
6.7 Processor Clocking Signals................................................................................ 117
6.8 Testability Signals ........................................................................................... 117
6.9 Error and Thermal Protection Signals ................................................................. 118
6.10 Power Sequencing Signals ................................................................................ 118
6.11 Processor Power Rails ...................................................................................... 119
6.12 Ground, Reserved and Non-Critical to Function (NCTF) Signals .............................. 120
6.13 Processor Internal Pull-Up / Pull-Down Terminations ............................................ 121
7 Electrical Specifications ......................................................................................... 122
7.1 Processor Power Rails ..................................................................................... 122
7.1.1 Power and Ground Pins ......................................................................... 122
7.1.2 V
CC
Voltage Identification (VID) ............................................................. 122
7.2 DC Specifications............................................................................................. 123
7.2.1 Processor Power Rails DC Specifications .................................................. 123
7.2.2 Processor Interfaces DC Specifications .................................................... 133
8 Package Mechanical Specifications ........................................................................ 139
8.1 Package Mechanical Attributes .......................................................................... 139
8.2 Package Loading Specifications ......................................................................... 139
8.3 Package Storage Specifications ......................................................................... 140