Specification Sheet

Datasheet, Volume 1 of 2 15
Introduction
• External Thermal Sensor (TS-on-DIMM and TS-on-Board)
• Render Thermal Throttling
• Fan speed control with DTS
• Intel Turbo Boost Technology 2.0 Power Control
Refer to Chapter 5, “Thermal Management” for more information.
1.5 Package Support
The processor is available in the following packages:
• A 46 mm x 24 mm BGA package (BGA1528) for U-Processor Line
• A 42 mm x 28 mm BGA package (BGA1440) for H-Processor Line
• A 37.5 mm x 37.5 mm LGA package (LGA1151) for S-Processor Line
1.6 Ballout Information
Refer to the Related Documents section for document information.
1.7 Processor Testability
An XDP on-board connector is warmly recommended to enable full debug capabilities.
For the processor SKUs, a merged XDP connector is highly recommended to enable
lower C-state debug.
Note: When separate XDP connectors will be used at C8–C10 states, the processor will need
to be waked up using the PCH.
The processor includes boundary-scan for board and system level testability.
1.8 Operation System Support
1.9 Terminology
Processor Line
Windows* 10
64-bit
OS X Linux* OS Chrome* OS
S-processor line Yes Yes Yes No
H-processor line Yes Yes Yes No
U-processor line Yes Yes No No
Table 1-2. Terminology (Sheet 1 of 3)
Term Description
4K Ultra High Definition (UHD)
AES Advanced Encryption Standard
AGC Adaptive Gain Control
BLT Block Level Transfer