Specification Sheet

Datasheet, Volume 1 of 2 139
Package Mechanical Specifications
8 Package Mechanical
Specifications
8.1 Package Mechanical Attributes
The UandH-Processor Line use a Flip Chip technology available in a Ball Grid Array
(BGA) package. The S-Processor Line uses a Flip Chip technology available in Land Grid
Array (LGA). The following table provides an overview of the mechanical attributes of
the package.
8.2 Package Loading Specifications
Table 8-1. Package Mechanical Attributes
Package Parameter
U-Processor
Line
H-Processor
Line
S-Processor
Line
4-Core/2-Core
GT3+OPC
6-Core GT2
8-Core/6-Core / 4-
Core GT2
Package
Technology
Package Type
Flip Chip Ball Grid
Array
Flip Chip Ball Grid
Array
Flip Chip Land Grid
Array
Interconnect Ball Grid Array
(BGA)
Ball Grid Array
(BGA)
Land Grid Array
(LGA)
Lead Free Yes Yes N/A
Halogenated
Flame
Retardant Free
Yes Yes Yes
Package
Configuration
Solder Ball
Composition
SAC405 SAC405 N/A
Ball/Pin Count 1528 1440 1151
Grid Array
Pattern
Balls Anywhere Balls Anywhere Grid Array
Land Side
Capacitors
Yes Yes Yes
Die Side
Capacitors
No Yes Yes No
Die
Configuration
3 Dice MCP
1 Die
Single-Chip
Package
1 Die
Single-Chip Package
with IHS
Package
Dimensions
Nominal
Package Size
46x24 mm 42x28 mm 37.5x37.5 mm
Min Ball/Pin
pitch
0.65 mm 0.65 mm 0.914 mm