User Guide

Datasheet, Volume 1 of 2 19
Interfaces
2 Interfaces
2.1 System Memory Interface
Two channels of DDR3L/-RS, and DDR4 memory with a maximum of two DIMMs
per channel. DDR technologies, number of DIMMs per channel, number of ranks
per channel are SKU dependent.
UDIMM, SO-DIMM, and Memory Down support (based on SKU)
Single-channel and dual-channel memory organization modes
Data burst length of eight for all memory organization modes
DDR3L/-RS I/O Voltage of 1.35V - based on Processor Line
DDR4 I/O Voltage of 1.2V
64-bit wide channels
Non-ECC UDIMM and SODIMM DDR4/DDR3L/-RS support (based on SKU)
Theoretical maximum memory bandwidth of:
20.8 GB/s in dual-channel mode assuming 1333 MT/s
25.0 GB/s in dual-channel mode assuming 1600 MT/s
33.3 GB/s in dual-channel mode assuming 2133 MT/s
37.5 GB/s in dual-channel mode assuming 2400 MT/s
Note: Memory down of all technologies (DDR3L/DDR4) should be implemented
homogeneously, which means that all DRAM devices should be from the same vendor
and have the same part number. Implementing a mix of DRAM devices may cause
serious signal integrity and functional issues.
Note: If the S-Processor Lines memory interface is configured to one DIMM per Channel, the
processor can use either of the DIMMs, DIMM0 or DIMM1, signals CTRL[1:0] or
CTRL[3:2].
2.1.1 System Memory Technology Supported
The Integrated Memory Controller (IMC) supports DDR3L/-RS, and DDR4 protocols
with two independent, 64-bit wide channels.
Table 2-1. Processor DRAM Support Matrix
Processor Line DPC
1
DDR3L/-RS [MT/s] DDR4 [MT/s] LPDDR3 [MT/s]
S-Processor Line 2 1333/1600 2133
3
/2400 N/A
Notes:
1. DPC = DIMM Per Channel
2. N/A
3. S-Processor SO-DIMM 2DPC is limited to 2133 MT/s due to Daisy Chain topology.