User Guide

Datasheet, Volume 1 of 2 15
Introduction
• External Thermal Sensor (TS-on-DIMM and TS-on-Board)
• Render Thermal Throttling
• Fan speed control with DTS
• Intel Turbo Boost Technology 2.0 Power Control
Refer to Chapter 5, “Thermal Management” for more information.
1.4 Package Support
The processor is available in the following packages:
• A 37.5 mm x 37.5 mm LGA package (LGA1151) for S-Processor Line
1.5 Processor Testability
An XDP on-board connector is warmly recommended to enable full debug capabilities.
For the processor SKUs, a merged XDP connector is highly recommended to enable
lower C-state debug.
Note: When separate XDP connectors will be used at C8 state, the processor will need to be
waked up using the PCH.
The processor includes boundary-scan for board and system level testability.
1.6 Terminology
Table 1-2. Terminology (Sheet 1 of 3)
Term Description
4K Ultra High Definition (UHD)
AES Advanced Encryption Standard
AGC Adaptive Gain Control
BLT Block Level Transfer
BPP Bits per pixel
CDR Clock and Data Recovery
CTLE Continuous Time Linear Equalizer
DDI Digital Display Interface for DP or HDMI/DVI
DDR3 Third-generation Double Data Rate SDRAM memory technology
DDR3L/RS DDR3 Low Voltage Reduced Standby Power
DDR4/DDR4-RS
Fourth-Generation Double Data Rate SDRAM Memory Technology
RS - Reduced Standby Power
DFE decision feedback equalizer
DMA Direct Memory Access
DMI Direct Media Interface
DP DisplayPort*
DTS Digital Thermal Sensor