Specification Sheet

Thermal Management
84 Datasheet, Volume 1 of 2
In each mode, the Intel Turbo Boost Technology 2.0 power limits are reprogrammed
along with a new OS controlled frequency range. The DPTF driver assists in all these
operations. The cTDP mode does not change the max per-processor IA core turbo
frequency.
5.1.4.2 Low-Power Mode
Low-Power Mode (LPM) can provide cooler and quieter system operation. By combining
several active power limiting techniques, the processor can consume less power while
running at equivalent low frequencies. Active power is defined as processor power
consumed while a workload is running and does not refer to the power consumed
during idle modes of operation. LPM is only available using the Intel DPTF driver.
Through the DPTF driver, LPM can be configured to use each of the following methods
to reduce active power:
• Restricting package power control limits and Intel Turbo Boost Technology
availability Off-Lining processor IA core activity (Move processor traffic to a subset
of cores)
• Placing a processor IA Core at LFM or LSF (Lowest Supported Frequency) Utilizing
IA clock modulation.
LPM power as listed in the TDP Specifications table is defined at point which processor
IA core working at LSF, GT = RPn and 1 IA core active.
Off-lining processor IA core activity is the ability to dynamically scale a workload to a
limited subset of cores in conjunction with a lower turbo power limit. It is one of the
main vectors available to reduce active power. However, not all processor activity is
ensured to be able to shift to a subset of cores. Shifting a workload to a limited subset
of cores allows other processor IA cores to remain idle and save power. Therefore,
when LPM is enabled, less power is consumed at equivalent frequencies.
Minimum Frequency Mode MFM of operation, which is the lowest supported frequency
(LSF) at the LFM voltage, has been made available for use under LPM for further
reduction in active power beyond LFM capability to enable cooler and quieter modes of
operation.
5.1.5 Thermal Management Features
Occasionally the processor may operate in conditions that are near to its maximum
operating temperature. This can be due to internal overheating or overheating within
the platform. In order to protect the processor and the platform from thermal failure,
TDP-Up
The SKU-specific processor IA core frequency where manufacturing confirms logical
functionality within the set of operating condition limits specified for the SKU segment
and Configurable TDP-Up configuration in Ta b le 5 - 2 . The Configurable TDP-Up Frequency
and corresponding TDP is higher than the processor IA core Base Frequency and SKU
Segment Base TDP.
TDP-Down
The processor IA core frequency where manufacturing confirms logical functionality
within the set of operating condition limits specified for the SKU segment and
Configurable TDP-Down configuration in Ta b le 5 - 2. The Configurable TDP-Down
Frequency and corresponding TDP is lower than the processor IA core Base Frequency
and SKU Segment Base TDP.
Table 5-1. Configurable TDP Modes (Sheet 2 of 2)
Mode Description