Specification Sheet

6 Datasheet, Volume 1 of 2
5.3 S-Processor Line Thermal and Power Specifications ................................................92
5.3.1 Thermal Profile for PCG 2015D Processor ...................................................93
5.3.2 Thermal Profile for PCG 2015C Processor ...................................................94
5.3.3 Thermal Profile for PCG 2015B Processor ...................................................95
5.3.4 Thermal Metrology..................................................................................97
5.3.5 Fan Speed Control Scheme with Digital Thermal Sensor (DTS) 1.1 ................97
5.3.6 Fan Speed Control Scheme with Digital Thermal Sensor (DTS) 2.0 ................99
6 Signal Description..................................................................................................100
6.1 System Memory Interface ................................................................................. 100
6.2 PCI Express* Graphics (PEG) Signals.................................................................. 102
6.3 Direct Media Interface (DMI) Signals .................................................................. 102
6.4 Reset and Miscellaneous Signals ........................................................................ 103
6.5 embedded DisplayPort* (eDP*) Signals............................................................... 103
6.6 Display Interface Signals .................................................................................. 104
6.7 Processor Clocking Signals ................................................................................ 104
6.8 Testability Signals............................................................................................ 105
6.9 Error and Thermal Protection Signals.................................................................. 105
6.10 Power Sequencing Signals................................................................................. 106
6.11 Processor Power Rails....................................................................................... 107
6.12 Ground, Reserved and Non-Critical to Function (NCTF) Signals............................... 108
6.13 Processor Internal Pull-Up / Pull-Down Terminations.............................................108
7 Electrical Specifications ......................................................................................... 109
7.1 Processor Power Rails.......................................................................................109
7.1.1 Power and Ground Pins.......................................................................... 109
7.1.2 V
CC
Voltage Identification (VID).............................................................. 109
7.2 DC Specifications .............................................................................................110
7.2.1 Processor Power Rails DC Specifications...................................................110
7.2.1.1 Vcc DC Specifications............................................................... 110
7.2.1.2 Vcc
GT
DC Specifications............................................................ 111
7.2.1.3 VDDQ DC Specifications ...........................................................112
7.2.1.4 VccSA DC Specifications ........................................................... 113
7.2.1.5 VccIO DC Specifications ...........................................................113
7.2.1.6 VccST DC Specifications ...........................................................114
7.2.1.7 VccPLL DC Specifications .......................................................... 114
7.2.2 Processor Interfaces DC Specifications.....................................................115
7.2.2.1 DDR4 DC Specifications............................................................ 115
7.2.2.2 PCI Express* Graphics (PEG) DC Specifications ........................... 116
7.2.2.3 Digital Display Interface (DDI) DC Specifications ......................... 116
7.2.2.4 embedded DisplayPort* (eDP*) DC Specification..........................117
7.2.2.5 CMOS DC Specifications ...........................................................117
7.2.2.6 GTL and OD DC Specifications ...................................................117
7.2.2.7 PECI DC Characteristics............................................................ 118
8 Package Mechanical Specifications.........................................................................120
8.1 Package Mechanical Attributes........................................................................... 120
8.2 Package Storage Specifications.......................................................................... 120
9 Processor Ball Information ....................................................................................122
9.1 Ball Map ......................................................................................................... 122
9.2 Ball Listing...................................................................................................... 125
Figures
1-1 S-Processor Line Platform ........................................................................................11
2-1 Intel
®
Flex Memory Technology Operations ................................................................21