Specification Sheet

Introduction
14 Datasheet, Volume 1 of 2
1.3 Thermal Management Support
• Digital Thermal Sensor
•Intel Adaptive Thermal Monitor
• THERMTRIP# and PROCHOT# support
• On-Demand Mode
• Memory Open and Closed Loop Throttling
• Memory Thermal Throttling
• External Thermal Sensor (TS-on-DIMM and TS-on-Board)
• Render Thermal Throttling
• Fan speed control with DTS
• Intel Turbo Boost Technology 2.0 Power Control
Refer to Chapter 5, “Thermal Management” for more information.
1.4 Package Support
• The processor is available in A 37.5 mm x 37.5 mm LGA package (LGA1151) for S-
Processor Line
1.5 Ballout Information
The processor ball information is available in Chapter 9, “Processor Ball Information”.
1.6 Processor Testability
An XDP on-board connector is warmly recommended to enable full debug capabilities.
For the processor SKUs, a merged XDP connector is highly recommended to enable
lower C-state debug.
Note: When separate XDP connectors will be used at C8 state, the processor will need to be
waked up using the PCH.
The processor includes boundary-scan for board and system level testability.
1.7 Terminology
Table 1-2. Terminology (Sheet 1 of 3)
Term Description
4K Ultra High Definition (UHD)
AES Advanced Encryption Standard
AGC Adaptive Gain Control
BLT Block Level Transfer
BPP Bits per pixel
CDR Clock and Data Recovery