Specification Sheet

Package Mechanical Specifications
120 Datasheet, Volume 1 of 2
8 Package Mechanical
Specifications
8.1 Package Mechanical Attributes
The S-Processor Line uses a Flip Chip technology available in Land Grid Array (LGA).
The following table provides an overview of the mechanical attributes of the package.
8.2 Package Storage Specifications
Table 8-1. Package Mechanical Attributes
Package Parameter
S-Processor Line
Hexa Core / Quad Core GT2
Package
Technology
Package Type
Flip Chip Land Grid Array
Interconnect
Land Grid Array (LGA)
Lead Free N/A
Halogenated Flame Retardant
Free
Yes
Package
Configuration
Solder Ball Composition N/A
Ball/Pin Count 1151
Grid Array Pattern Grid Array
Land Side Capacitors Yes
Die Side Capacitors Yes Yes
Die Configuration
1 Die
Single-Chip Package with IHS
Package
Dimensions
Nominal Package Size 37.5x37.5 mm
Min Ball/Pin pitch 0.914 mm
Table 8-2. Package Storage Specifications (Sheet 1 of 2)
Parameter Description Min Max Notes
T
ABSOLUTE STORAGE
The non-operating device storage temperature.
Damage (latent or otherwise) may occur when
subjected to this temperature for any length of
time in Intel Original sealed moisture barrier bag.
-25 °C 125 °C 1, 2, 3
T
SUSTAINED STORAGE
The ambient storage temperature limit (in
shipping media) for the sustained period of time
as specified below in Intel Original sealed
moisture barrier bag.
-5 °C 40 °C 1, 2, 3