Specification Sheet

Datasheet, Volume 1 of 2 47

Electrical Specifications
maximum or minimum device storage conditions for a sustained period of time. At
conditions outside sustained limits, but within absolute maximum and minimum
ratings, quality and reliability may be affected.
5.5 DC Specifications
DC specifications are defined at the processor pads, unless otherwise noted.
DC specifications are only valid while meeting specifications for case temperature, clock
frequency, and input voltages. Care should be taken to read all notes associated with
each specification.
5.5.1 Voltage and Current Specifications
Table 5-10. Storage Condition Ratings
Symbol Parameter Min Max Unit
T
absolute storage The minimum/maximum device storage
temperature beyond which damage (latent or
otherwise) may occur when subjected to for
any length of time.
-25 125 °C
T
sustained storage The minimum/maximum device storage
temperature for a sustained period of time.
-5 40 °C
T
short term storage The ambient storage temperature (in shipping
media) for a short period of time.
-20 85 °C
RH
sustained storage The maximum device storage relative humidity
for a sustained period of time.Unopened bag,
includes 6 months storage time by customer.
60% @ 24 °C
Time
short term storage A short period of time (in shipping media). 0 72 hours
Notes:
1. Storage conditions are applicable to storage environments only. In this scenario, the processor must not
receive a clock, and no lands can be connected to a voltage bias. Storage within these limits will not
affect the long-term reliability of the device. For functional operation, please refer to the processor case
temperature specifications.
2. These ratings apply to the Intel component and do not include the tray or packaging.
3. Failure to adhere to this specification can affect the long-term reliability of the processor.
4. Non-operating storage limits post board attach: Storage condition limits for the component once
attached to the application board are not specified. Intel does not conduct component level certification
assessments post board attach given the multitude of attach methods, socket types and board types
used by customers. Provided as general guidance only, Intel board products are specified and certified to
meet the following temperature and humidity limits (Non-Operating Temperature Limit: -40 °C to 70 °C
and Humidity: 50% to 90%, non condensing with a maximum wet bulb of 28 °C).
5. Device storage temperature qualification methods follow JEDEC High and Low Temperature Storage Life
Standards: JESD22-A119 (low temperature) and JESD22-A103 (high temperature).
Table 5-11. Voltage Specification (Sheet 1 of 2)
Symbols Parameter
Voltage
Plane
Min Nom Max Unit Notes
1
V
CCIN Input to Integrated
Voltage Regulator
V
CCIN
= VID -
Rll*Iout-0.022V
= VID -
Rll*Iout
= VID -
Rll*Iout+0.022V
V
2, 3, 4, 5,
8, 12
V
CCIN VID Range
V
CCIN 1.60 1.80 1.83 V
2, 3, 4, 5,
8, 12
V
VID_STEP
(V
CCIN
)
VID step size during a
transition
V
CCIN — 10.0 — mV
6
V
VID_STEP
(V
CCD
)
VID step size during a
transition
—5—10mV