User Manual

Electrical Specifications
52 Datasheet
5.6 DC Specifications
DC specifications are defined at the processor pads, unless otherwise noted.
DC specifications are only valid while meeting specifications for case temperature
(T
CASE
specified in the Processor Thermal/Mechanical Specification and Design Guide)
(See Related Documents Section), clock frequency, and input voltages. Care should be
taken to read all notes associated with each specification.
Table 5-9. Storage Condition Ratings
Symbol Parameter Min Max Unit
T
absolute storage
The minimum/maximum device storage temperature
beyond which damage (latent or otherwise) may occur
when subjected to for any length of time.
-25 125 °C
T
sustained storage
The minimum/maximum device storage temperature for a
sustained period of time.
-5 40 °C
T
short term storage
The ambient storage temperature (in shipping media) for
a short period of time.
-20 85 °C
RH
sustained storage
The maximum device storage relative humidity for a
sustained period of time.
60% @ 24 °C
Time
sustained
storage
A prolonged or extended period of time; typically
associated with sustained storage conditions
Unopened bag, includes 6 months storage time by
customer.
0 30 months
Time
short term
storage
A short period of time (in shipping media).
0 72 hours
Notes:
1. Storage conditions are applicable to storage environments only. In this scenario, the processor must not
receive a clock, and no lands can be connected to a voltage bias. Storage within these limits will not
affect the long-term reliability of the device. For functional operation, please refer to the processor case
temperature specifications.
2. These ratings apply to the Intel component and do not include the tray or packaging.
3. Failure to adhere to this specification can affect the long-term reliability of the processor.
4. Non-operating storage limits post board attach: Storage condition limits for the component once
attached to the application board are not specified. Intel does not conduct component level certification
assessments post board attach given the multitude of attach methods, socket types and board types
used by customers. Provided as general guidance only, Intel board products are specified and certified to
meet the following temperature and humidity limits (Non-Operating Temperature Limit: -40 °C to 70 °C
and Humidity: 50% to 90%, non condensing with a maximum wet bulb of 28 °C).
5. Device storage temperature qualification methods follow JEDEC High and Low Temperature Storage Life
Standards: JESD22-A119 (low temperature) and JESD22-A103 (high temperature).