Datasheet

Symbol Parameter Min Max Unit
2. Overshoot and undershoot voltage guidelines for input, output, and I/O signals are outlined in Overshoot/
Undershoot Tolerance on page 44. Excessive Overshoot or undershoot on any signal will likely result in
permanent damage to the processor.
Storage Conditions Specifications
Environmental storage condition limits define the temperature and relative humidity
limits to which the device is exposed to while being stored in a Moisture Barrier Bag.
The specified storage conditions are for component level prior to board attach (see
notes in the table below for post board attach limits).
The table below specifies absolute maximum and minimum storage temperature limits
which represent the maximum or minimum device condition beyond which damage,
latent or otherwise, may occur. The table also specifies sustained storage
temperature, relative humidity, and time-duration limits. These limits specify the
maximum or minimum device storage conditions for a sustained period of time. At
conditions outside sustained limits, but within absolute maximum and minimum
ratings, quality and reliability may be affected.
Table 12. Storage Condition Ratings
Symbol Parameter Min Max Unit
T
absolute storage
The minimum/maximum device storage
temperature beyond which damage (latent or
otherwise) may occur when subjected to for
any length of time.
-25 125 °C
T
sustained storage
The minimum/maximum device storage
temperature for a sustained period of time.
-5 40 °C
T
short term storage
The ambient storage temperature (in shipping
media) for a short period of time.
-20 85 °C
RH
sustained storage
The maximum device storage relative humidity
for a sustained period of time.
60% @ 24 °C
Time
sustained storage
A prolonged or extended period of time;
typically associated with sustained storage
conditions
Unopened bag, includes 6 months storage time
by customer.
0 30 months
Time
short term storage
A short period of time (in shipping media). 0 72 hours
Note:
1. Storage conditions are applicable to storage environments only. In this scenario, the processor must not
receive a clock, and no lands can be connected to a voltage bias. Storage within these limits will not
affect the long-term reliability of the device. For functional operation, please refer to the processor case
temperature specifications.
2. These ratings apply to the Intel component and do not include the tray or packaging.
3. Failure to adhere to this specification can affect the long-term reliability of the processor.
4. Non-operating storage limits post board attach: Storage condition limits for the component once attached
to the application board are not specified. Intel does not conduct component level certification
assessments post board attach given the multitude of attach methods, socket types and board types
used by customers. Provided as general guidance only, Intel board products are specified and certified to
meet the following temperature and humidity limits (Non-Operating Temperature Limit: -40C to 70C &
Humidity: 50% to 90%, non condensing with a maximum wet bulb of 28°C).
5. Device storage temperature qualification methods follow JEDEC High and Low Temperature Storage Life
Standards: JESD22-A119 (low temperature) and JESD22-A103 (high temperature).
Intel
®
Xeon
®
Processor E5-1600 and E5-2600 v3 Product Families—Electrical Specifications
Intel
®
Xeon
®
Processor E5-1600 and E5-2600 v3 Product Families, Volume 1 of 2, Electrical
Datasheet September 2014
30 Order No.: 330783-001