Specification Sheet

Thermal Management Specifications
108 Intel
®
Xeon
®
Processor E5-1600/E5-2600/E5-4600 v2 Product Families
Datasheet Volume One of Two
5.1.3.3 Digital Thermal Sensor (DTS) thermal profiles
Each DTS thermal profile is unique to each TDP and core count combination. These
T
DTS
profiles are fully defined by the simple linear equation:
T
DTS
= PSI
PA
* P + T
LA
Where:
PSI
PA
is the Processor-to-Ambient thermal resistance of the processor thermal solution.
T
LA
is the Local Ambient temperature.
P is the processor power dissipation.
Tab l e 5 - 2 provides the
PSI
PA
and T
LA
parameters that define T
DTS
thermal profile for
each TDP/Core count combination. Figure 5-2 illustrates the general form of the
resulting linear graph resulting from
T
DTS
= PSI
PA
* P + T
LA
.
5.1.3.4 Digital Thermal Sensor (STS) Specifications
Figure 5-1. T
Case
Temperature Thermal Profile
Table 5-2. Digital Thermal Sensor (DTS) Specification Summary (Sheet 1 of 2)
TDP (W) Model Number
Core
Count
T
LA
(°C) PSI
PA
(°C/W)
Maximum
T
DTS
(°C)
150W WS E5-2687W v2 8 39.5 0.353 92.4
130W 1U E5-2697 v2 12 56.5 0.320 98.1
E5-2690 v2 10 56.5 0.353 102.4
E5-4627 v2 8 56.5 0.372 104.9