Datasheet

Thermal and Mechanical Design Guidelines 5
7.2 Board and System Implementation of Intel
®
QST......................................68
7.3 Intel
®
QST Configuration & Tuning..........................................................70
7.4 Fan Hub Thermistor and Intel
®
QST ........................................................70
Appendix A LGA775 Socket Heatsink Loading ......................................................................71
A.1 LGA775 Socket Heatsink Considerations ..................................................71
A.2 Metric for Heatsink Preload for ATX/uATX Designs Non-Compliant
with Intel
®
Reference Design .................................................................71
A.3 Heatsink Preload Requirement Limitations................................................71
A.3.1 Motherboard Deflection Metric Definition.....................................72
A.3.2 Board Deflection Limits ............................................................73
A.3.3 Board Deflection Metric Implementation Example.........................74
A.3.4 Additional Considerations .........................................................75
A.3.4.1 Motherboard Stiffening Considerations .........................76
A.4 Heatsink Selection Guidelines.................................................................76
Appendix B Heatsink Clip Load Metrology............................................................................77
B.1 Overview ............................................................................................77
B.2 Test Preparation...................................................................................77
B.2.1 Heatsink Preparation................................................................77
B.2.2 Typical Test Equipment ............................................................80
B.3 Test Procedure Examples.......................................................................80
B.3.1 Time-Zero, Room Temperature Preload Measurement...................81
B.3.2 Preload Degradation under Bake Conditions ................................81
Appendix C Thermal Interface Management.........................................................................83
C.1 Bond Line Management .........................................................................83
C.2 Interface Material Area..........................................................................83
C.3 Interface Material Performance...............................................................83
Appendix D Case Temperature Reference Metrology..............................................................85
D.1 Objective and Scope .............................................................................85
D.2 Supporting Test Equipment....................................................................85
D.3 Thermal calibration and controls.............................................................87
D.4 IHS Groove .........................................................................................87
D.5 Thermocouple Attach Procedure .............................................................91
D.5.1 Thermocouple Conditioning and Preparation ................................91
D.5.2 Thermocouple Attachment to the IHS.........................................92
D.5.3 Solder Process ........................................................................97
D.5.4 Cleaning & Completion of Thermocouple Installation................... 100
D.6 Thermocouple Wire Management .......................................................... 104
Appendix E Balanced Technology Extended (BTX) System Thermal Considerations.................. 105
Appendix F Fan Performance for Reference Design ............................................................. 109
Appendix G Mechanical Drawings ..................................................................................... 111
Appendix H Intel
®
Enabled Reference Solution Information .................................................. 127