Datasheet

Package Mechanical Specifications and Pin Information
66 Datasheet
Table 15. New Pins for the Quad-Core Mobile Processor
Pin Name Pin# Description
BPM_2[0]# N5 BPM_2[3:0]# (Breakpoint Monitor) are breakpoint and performance
monitor signals of the second die. They are outputs from the
processor that indicate the status of breakpoints and programmable
counters used for monitoring processor performance. BPM_2[3:0]#
should connect the appropriate pins of all processor FSB agents.This
includes debug or performance monitoring tools.
BPM_2[1]# M4
BPM_2[2]# B2
BPM_2[3]# AE8
BR1# AA7
Arbitration Request signal for the second die.
BR1# is connected to the first die within the package, allowing two
dies within quad-core parts to artitrite for the bus. This pin is
fundamentally provided for debug capabilities and should be left as a
NC.
GTLREF_2 D22 GTL reference level for AGTL+ input pins of the second die.
GTLREF_CONTROL F8
This pin can be used as GTLREF_2 disconnect circuit control signal.
GTLREF_2 maps out to a reserved pin on Intel Core
2 Duo mobile
processor, for dual-core and quad-core interchangeable
motherboard,GTLREF_CONTROL can be used as a control signal for a
circuit that will automaticlly switch between Dual Core and quad-
core modes.
RSVD AC8
These pins are RESERVED and must be left unconnected on the
board. However, it is recommended that routing channels to these
pins on the board be kept open for possible future use.
RSVD AA8
RSVD D8
TDI_M F6
TDI_M (Test Data In) transfers serial test data into the second die.
TDI_M provides the serial input needed for JTAG specification
support. Connect to TDO_M on the platform.
TDO_M D3
TDO_M (Test Data Out) transfers serial test data out of the first die.
TDO_M provides the serial output needed for JTAG specification
support. Connect to TDI_M on the platform.
THRMDA_2 T2 Thermal Diode Anode of the second die.
THRMDC_2 V3 Thermal Diode Cathode of the second die.
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