Datasheet

Datasheet 37
Package Mechanical Specifications and Pin Information
4 Package Mechanical
Specifications and Pin
Information
4.1 Package Mechanical Specifications
The processor is available in a 478-pin Micro-FCPGA package. The package mechanical
dimensions are shown in Figure 6 and Figure 7.
The mechanical package pressure specifications are in a direction normal to the surface
of the processor. This requirement protects the processor die from fracture risk due to
uneven die pressure distribution under tilt, stack-up tolerances and other similar
conditions. These specifications assume that a mechanical attach is designed
specifically to load one type of processor.
The processor package substrate should not be used as a mechanical reference or load-
bearing surface for the thermal or mechanical solution.