User Manual

64 Datasheet
Pentium
®
III Processor for the PGA370 Socket at 500 MHz to 1.13 GHz
NOTE: Capacitors will be placed on the pin-side of the FC-PGA package in the area defined by G1, G2, and
G3. This area is a keepout zone for motherboard designers.
For Table 38, the following apply:
1. It is not recommended to use any portion of the processor substrate as a mechanical reference
or load bearing surface for thermal solutions.
2. Parameters assume uniformly applied loads
NOTES:
1. Transient loading refers to a one time short duration loading, such as during heatsink installation.
2. Dynamic loading refers to a shock load.
3. This is the maximum static force that can be applied by the heatsink and clip to maintain the heatsink and
processor interface.
4. Please see socket manufacturer’s force loading specification also to ensure compliance. Maximum static
loading listed here does not account for the maximum reaction forces on the socket tabs or pins. Designs
must ensure that the socket can withstand this force.
Pin TP 0.508 Diametric True Position (Pin-to-Pin) 0.020 Diametric True Position (Pin-to-Pin)
Table 37. Package Dimensions for Intel
®
Pentium
®
III Processor FC-PGA2 Package
Symbol
Millimeters Inches
Minimum Maximum Notes Minimum Maximum Notes
Table 38. Processor Case Loading Parameters for FC-PGA2
Parameter
Transient
(max)
1, 4
Dynamic
(max)
2, 4
Static
(max)
3, 4
Unit
IHS Surface 200 200 100 lbf
IHS Edge 125 N/A N/A lbf
IHS Corner 75 N/A N/A lbf
Figure 25. FC-PGA2 Flatness Specification
Note: Flatness specifications in millimeters