User Manual

Pentium
®
III Processor for the PGA370 Socket at 500 MHz to 1.13 GHz
6 Datasheet
Tables
1 Processor Identification.......................................................................................10
2 Voltage Identification Definition...........................................................................21
3 System Bus Signal Groups 1 ..............................................................................23
4 System Bus Signal Groups (AGTL)1 ..................................................................23
5 Frequency Select Truth Table for BSEL[1:0] ......................................................26
6 Absolute Maximum Ratings ................................................................................26
7 Voltage and Current Specifications ....................................................................28
8 PL Slew Rate Data (23A) ....................................................................................33
9 AGTL / AGTL+ Signal Groups DC Specifications ..............................................34
10 Non-AGTL+ Signal Group DC Specifications .....................................................34
11 Non-AGTL Signal Group DC Specifications .......................................................35
12 Processor AGTL+ Bus Specifications ................................................................36
13 Processor AGTL Bus Specifications ..................................................................36
14 System Bus AC Specifications (SET Clock) .......................................................37
15 System Bus Timing Specifications (Differential Clock) .......................................38
16 System Bus AC Specifications (AGTL+ or AGTL Signal Group) ........................39
17 System Bus AC Specifications (CMOS Signal Group) .......................................40
18 System Bus AC Specifications (Reset Conditions) ............................................40
19 System Bus AC Specifications (APIC Clock and APIC I/O)................................40
20 Platform Power-On Timings................................................................................40
21 BCLK/PICCLK Signal Quality Specifications for Simulation at the
Processor Pins ...................................................................................................46
22 BCLK/PICCLK Signal Quality Specifications for Simulation at the Processor Pins
in a Differential Clock Platform for AGTL ............................................................46
23 AGTL+ Signal Groups Ringback Tolerance Specifications at the Processor
Pins ....................................................................................................................47
24 Example Platform Information.............................................................................50
25 100 MHz AGTL+ / AGTL Signal Group Overshoot/Undershoot Tolerance at
Processor Pins.................................................................................................... 51
26 133 MHz AGTL+/AGTL Signal Group Overshoot/Undershoot Tolerance ..........52
27 33 MHz CMOS Signal Group Overshoot/Undershoot Tolerance at
Processor Pins.................................................................................................... 52
28 Signal Ringback Specifications for Non-AGTL+ Signal Simulations at the
Processor Pins.................................................................................................... 55
29 Signal Ringback Specifications for Non-AGTL Signal Simulations at
the Processor Pins .............................................................................................55
30 Intel® Pentium® III Processor Thermal Design Power for the FC-PGA Package ..
56
31 Intel® Pentium® III Processor for the FC-PGA2 Package Thermal
Design Power......................................................................................................57
32 Processor Functional Die Layout for FC-PGA ....................................................58
33 Thermal Diode Parameters .................................................................................59
34 Thermal Diode Interface......................................................................................59
35 Intel® Pentium® III Processor Package Dimensions..........................................61
36 Processor Die Loading Parameters for FC-PGA ................................................62
37 Package Dimensions for Intel® Pentium® III Processor FC-PGA2 Package .....63
38 Processor Case Loading Parameters for FC-PGA2 ........................................... 64
39 Signal Listing in Order by Signal Name ..............................................................69
40 Signal Listing in Order by Pin Number................................................................74