User Manual

Datasheet 57
Pentium
®
III Processor for the PGA370 Socket at 500 MHz to 1.10 GHz
2. Thermal Design Power (TDP) represents the maximum amount of power the thermal solution is required to
dissipate. The thermal solution should be designed to dissipate the TDP power without exceeding the
maximum Tjunction specification.
3. TDP does not represent the power delivery and voltage regulation requirements for the processor. Refer to
Table 6 for voltage regulation and electrical specifications.
4. T
junctionoffset
is the worst-case difference between the thermal reading from the on-die thermal diode and the
hottest location on the processor’s core.
5. Power density is the maximum power the processor die can dissipate (i.e., processor power) divided by the
die area over which the power is generated. Power for these processors is generated from the core area
shown in Figure 21.
6. T
JUNCTION offset values do not include any thermal diode kit measurement error. Diode kit measurement
error must be added to the T
JUNCTION offset value from the table, as outlined in the Intel
®
Pentium
®
III
processor Thermal Metrology for CPUID-068h Family Processors (Order Number: 245301). Intel has
characterized the use of the Analog Devices AD1021 diode measurement kit and found its measurement
errortobe1°C.
7. This specification only applies to 1B GHz S-Spec #: SL4WM. This part has a VID request of 1.70 V, however
the processor should be supplied 1.76 V at the PGA Vcc pins by the VRM (Voltage Regulator Module) or by
the voltage regulator circuit.
8. This specification applies to processors with CPUID 068AH. 1B GHz exists in both FC-PGA and FC-PGA2
packages.
9. This specification applies to processors with CPUID 0686H.
10. Tjunction minimum specification is 0 °C.
Table 31 provides the thermal design power dissipation and maximum temperatures for the
Pentium
III processor for the FC-PGA2 package. Systems should design for the highest possible
processor power, even if a processor with a lower thermal dissipation is planned. A thermal
solution should be designed to ensure the case temperature never exceeds these specifications.
NOTES:
1. These values are specified at nominal V
CC
CORE
for the processor pins.
2. Thermal Design Power (TDP) represents the maximum amount of power the thermal solution is required to
dissipate. The thermal solution should be designed to dissipate the TDP power without exceeding the
maximum Tcase specification.
3. TDP does not represent the power delivery and voltage regulation requirements for the processor. Refer to
Table 7 for voltage regulation and electrical specifications.
4. T
CaseOffset
is the worst-case difference between the maximum case temperature and the thermal diode
temperature on the processor’s core. For more information please refer to the document, Intel
®
Pentium
®
III
Processor in the FC-PGA2 Package Thermal Design Guide.
5. This processor exists in both FC-PGA and FC-PGA2 packages.
4.2 Processor Die Area
Figure 21 is a block diagram of the Pentium III processor die layout and Table 32 contains Pentium
III processor die layout measurements. The layout differentiates the processor core from the cache
die area. In effect, the thermal design power identified in Table 30 is dissipated entirely from the
processor core area. Thermal solution designs should compensate for this smaller heat flux area
and not assume that the power is uniformly distributed across the entire die area.
Table 31. Intel
®
Pentium
®
III Processor for the FC-PGA2 Package Thermal Design Power
1
Processor
Processor
Core
Frequency
(MHz)
System Bus
Frequency
(MHz)
Processor
Thermal Design
Power
2,3
CPUID 068Ah
(W)
Maximum
T
case
4
(°C)
Additional
Notes
866 866 133 29.5 70 5
933 933 133 31.5 72 5
1B GHz 1000 133 33.9 69 5
1.13 GHz 1133 133 37.5 72