User Manual

Pentium
®
III Processor for the PGA370 Socket at 500 MHz to 1.13 GHz
4 Datasheet
Guidelines ...........................................................................................................54
3.4.1 Overshoot/Undershoot Guidelines .........................................................54
3.4.2 Ringback Specification...........................................................................55
3.4.3 Settling Limit Guideline ..........................................................................55
4.0 Thermal Specifications and Design Considerations.................................56
4.1 Thermal Specifications........................................................................................56
4.2 Processor Die Area ............................................................................................. 57
4.3 Thermal Diode.....................................................................................................58
5.0 Mechanical Specifications ..................................................................................60
5.1 FC-PGA Mechanical Specifications .................................................................... 60
5.1.1 FC-PGA2 Mechanical Specifications .....................................................63
5.2 Processor Markings ............................................................................................65
5.2.1 Processor Markings for FC-PGA2..........................................................65
5.3 Recommended Mechanical Keep-Out Zones .....................................................66
5.4 Processor Signal Listing......................................................................................67
6.0 Boxed Processor Specifications.......................................................................80
6.1 Mechanical Specifications for the Boxed Intel
®
Pentium
®
III Processor.............. 80
6.1.1 Boxed Processor Thermal Cooling Solution Dimensions.......................80
6.1.2 Boxed Processor Heatsink Weight.........................................................82
6.1.3 Boxed Processor Thermal Cooling Solution Clip ...................................82
6.2 Thermal Specifications........................................................................................82
6.2.1 Boxed Processor Cooling Requirements ...............................................82
6.3 Electrical Requirements for the Boxed Intel
®
Pentium
®
III Processor.................83
6.3.1 Fan Heatsink Power Supply...................................................................83
7.0 Processor Signal Description.............................................................................85
7.1 Alphabetical Signals Reference ..........................................................................85
7.2 Signal Summaries...............................................................................................92