User's Manual

Intel

Ambler Module With Bluetooth* Wireless Technology

Design Guide, Rev. 4.1

SC-3216 Intel Secret 4

Design Criteria for Modular Approval

The Intel Personal Wireless Module(Ambler) with Bluetooth wireless technology may not be altered or

modified in any way upon receipt from Intel. Additionally, no external component can be added which

changes the radio frequency (RF) characteristics of the transmitted signals. This includes all

components both passive and active such as RF filters, RF amplifiers, RF switches, etc. RF components

may not be placed between the output pin of the Intel Personal Wireless Module(Ambler) and the Intel

enabled antennas except the RF transmission line that interconnects them.

Antennas

Only antennas bearing specific part numbers(refer to section 5) and qualified by Intel’s MA may be

used with the Intel Personal Wireless Module(Ambler) with Bluetooth wireless technology. These

antennas are designed to be compatible with the RF transmission line impedance and frequency

range of the Intel Personal Wireless Module(Ambler) with Bluetooth wireless technology. These

antennas may not be modified in any way from the design baseline as indicated by the antenna data

sheets from the manufacturer.

The antennas selected by Intel have been specifically tested with the Intel Personal Wireless

Module(Ambler) with Bluetooth wireless technology, and they are certified through the regulatory

agencies in the US, Canada, and European Union for authorized use. Use of antennas in a platform

other than the antennas selected by Intel voids the MA grant for that platform.

Antenna Interconnect

There are specific requirements that must be met when designing a transmission line interconnection

between the Intel Personal Wireless Module(Ambler) with Bluetooth wireless technology and the

antennas. The Intel Personal Wireless Module(Ambler) with Bluetooth wireless technology has

been specifically designed as a miniature component to be integrated into portable electronic

devices. As such the RF connection is not a standard connector, but a ball grid array solder

connection. The module should be mounted on a PCB directly or mounted in a specially designed

socket that is mounted to a PCB.

Impedance

The transmission line must be designed to be a 50-Ohm impedance.

Physical Implementation

The physical implementation of the RF transmission line must conform to the following guidelines:

Any combination of microstrip, stripline, or coaxial cable is acceptable. However, the following

guidelines must be adhered to:

1. Microstrip (conductor above ground plane): The total length of any microstrip transmission lines should not

exceed eight (8) inches. This applies whether multiple lines or a single section of line is used. The maximum

width of any microstrip transmission lines should not exceed 115 mils. An impedance of 50 +/- 2 ohms must be

maintained. For design formulae, the following web sites can be accessed for interactive design programs:

Table http://www.mit.edu/~mcmahill/software/mstrip/mscalc.htm

Table A http://www.polar.co.uk/

2. Stripline (conductor between ground planes on printed circuit board): Since stripline is non-radiating, any

length of stripline can be used. However, lengths should be minimized to keep losses at a minimum. Conductor