Specification Sheet

Product Description

1.9 Wireless LAN Subsystem

The wireless LAN subsystem consists of the following:

• Intel® Dual Band Wireless-AC 8260 module

• 1216 BGA soldered-down

For information about Refer to

LAN software and drivers http://downloadcenter.intel.com

1.9.1 Wireless Network Module

The Dual Band Wireless-AC 8260 module provides hi-speed wireless connectivity with the

following capabilities:

• 802.11a/b/g/n, 802.11ac

• 2.4 GHz, 5.0 GHz

• Two antennas

• Dual Mode Bluetooth 4.2

• Supports Intel® Wireless Display (WiDi)

• Support for AMT 11.0 on STK2MV64CC

For information about

Refer to

Obtaining WLAN software and drivers http://downloadcenter.intel.com

Full Specifications http://intel.com/wireless

1.10 Hardware Management Subsystem

The hardware management features enable the Compute Stick to be compatible with the Wired

for Management (WfM) specification. The Compute Stick has several hardware management

features, including thermal and voltage monitoring.

For information about

Refer to

Wired for Management (WfM) Specification www.intel.com/design/archives/wfm/