Intel® Compute Stick STK2M3W64CC STK2MV64CC STK2M364CC Technical Product Specification February 2016 Order Number: H86345-001
Revision History Revision Revision History Date 001 First release February 2016 Disclaimer This product specification applies to only the standard Intel® Compute Stick with BIOS identifier CCSKLM30.86A or CCSKLM5V.86A. INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT.
Preface This Technical Product Specification (TPS) specifies the layout, components, connectors, power and environmental requirements, and the BIOS for Intel Compute Stick STK2M3W64CC, STK2M364CC and STK2MV64CC. NOTE In this document, the use of “Intel Compute Stick” will refer to the STK2M3W64, STK2M364CC and STK2MV64CC versions of the Intel Compute Stick.
Intel Compute Stick STK2M3W64CC, STK2MV64CC and STK2M364CC Technical Product Specification Other Common Notation iv # Used after a signal name to identify an active-low signal (such as USBP0#) GB Gigabyte (1,073,741,824 bytes) GB/s Gigabytes per second Gb/s Gigabits per second KB Kilobyte (1024 bytes) Kb Kilobit (1024 bits) kb/s 1000 bits per second MB Megabyte (1,048,576 bytes) MB/s Megabytes per second Mb Megabit (1,048,576 bits) Mb/s Megabits per second TDP Thermal Design Power
Contents Revision History Errata............................................................................................................................................................................ ii Preface Intended Audience................................................................................................................................................ iii What This Document Contains .....................................................................................................
Intel Compute Stick STK2M3W64CC, STK2MV64CC and STK2M364CC Technical Product Specification 2.4 2.5 Reliability ..................................................................................................................................................... 26 Environmental ........................................................................................................................................... 27 3 Overview of BIOS Features 3.1 3.2 3.3 3.4 3.5 3.6 3.7 3.8 Introduction .............
1 Product Description 1.1 Overview 1.1.1 Version Summary There are three different versions of this model of Intel® Compute Stick available which are summarized in Table 1. Unless otherwise noted in this document all features are available on all versions of the Intel Compute Stick. Table 1.
Intel Compute Stick STK2M3W64CC, STK2MV64CC and STK2M364CC Technical Product Specification 1.1.3 Location of Components Figures 1 and 2 show the location of the components on the Intel Compute Stick. Item Description A HDMI Connector B Power LED C Security Loop D USB 3.0 Connector E Power On/Off Button Figure 1. Left-Side View of Intel Compute Stick Item Description A Micro SD Card Reader Slot B 5 V DC Connector Figure 2.
Product Description 1.1.4 Block Diagram Figure 3 is a block diagram of the major functional areas of the Intel Compute Stick. Figure 3.
Intel Compute Stick STK2M3W64CC, STK2MV64CC and STK2M364CC Technical Product Specification 1.2 Online Support To find information about… Visit this World Wide Web site: Intel Compute Stick http://www.intel.com/computesticksupport 1.3 Operating System Overview The STK2M3W64CC Compute Stick has Windows 10 Home 64-bit pre-installed with all necessary drivers. The STK2M364CC and STK2MV64CC Compute Sticks support the following Operating Systems (64-bit only).
Product Description 1.5 System Memory The Intel Compute Stick has soldered-down memory and supports the following memory features: • • • • LPDDR3 1866 MHz Dual-channel memory 2 GB memory per channel (4 GB total memory). Refer to Section 2.1.1 on page 21 for information on the total amount of addressable memory. 1.6 System Storage The Intel Compute stick has soldered-down storage using an Embedded MultiMediaCard (eMMC) component. All Compute Sticks have 64 GB of total storage.
Intel Compute Stick STK2M3W64CC, STK2MV64CC and STK2M364CC Technical Product Specification 1.7.1.3 High Definition Multimedia Interface* (HDMI*) The HDMI port supports standard, enhanced, or high definition video, plus multi-channel digital audio on a single cable. The port is compatible with all ATSC and DVB HDTV standards and supports eight full range channels at 24-bit/96 kHz audio of lossless audio formats. The maximum supported resolution is 4096 x 2160 @ 24 Hz, 24 bpp.
Product Description 1.9 Wireless LAN Subsystem The wireless LAN subsystem consists of the following: • • Intel® Dual Band Wireless-AC 8260 module 1216 BGA soldered-down For information about Refer to LAN software and drivers http://downloadcenter.intel.com 1.9.1 Wireless Network Module The Dual Band Wireless-AC 8260 module provides hi-speed wireless connectivity with the following capabilities: • • • • • • 802.11a/b/g/n, 802.11ac 2.4 GHz, 5.0 GHz Two antennas Dual Mode Bluetooth 4.
Intel Compute Stick STK2M3W64CC, STK2MV64CC and STK2M364CC Technical Product Specification 1.11 Power Management Power management is implemented at several levels, including: • • Software support through Advanced Configuration and Power Interface (ACPI) Hardware support: Power Input Instantly Available PC technology Wireless LAN wake capabilities Wake from USB Wake from S5 1.11.
Product Description 1.11.1.1 System States and Power States Under ACPI, the operating system directs all system and device power state transitions. The operating system puts devices in and out of low-power states based on user preferences and knowledge of how devices are being used by applications. Devices that are not being used can be turned off. The operating system uses information from applications and user settings to put the system as a whole into a low-power state.
Intel Compute Stick STK2M3W64CC, STK2MV64CC and STK2M364CC Technical Product Specification 1.11.1.2 Wake-up Devices and Events Table 5 lists the devices or specific events that can wake the Compute Stick from specific states. Table 5.
Product Description 1.11.2.1 Power Input When resuming from an AC power failure, the Compute Stick may return to the power state it was in before power was interrupted (on or off). The Compute Stick’s response can be set using the Last Power State feature in the BIOS Setup program’s Boot menu. 1.11.2.2 Instantly Available PC Technology Instantly Available PC technology enables the Compute Stick to enter the ACPI S3 (Suspend-toRAM) sleep-state.
Intel Compute Stick STK2M3W64CC, STK2MV64CC and STK2M364CC Technical Product Specification 1.12 Intel® Security and Manageability Technologies Intel® Security and Manageability Technologies provides tools and resources to help small business owners and IT organizations protect and manage their assets in a business or institutional environment. NOTE Software with security and/or manageability capability is required to take advantage of Intel platform security and/or management technologies. 1.12.
Product Description NOTE Intel AMT requires the Compute Stick to have network hardware and software, as well as connection with a power source, a corporate network connection, and an Intel AMT-enabled remote management console. Setup requires additional configuration of the platform. For information about Refer to Intel Active Management Technology http://www.intel.com/technology/platform-technology/intelamt/index.htm 1.12.1.
Intel Compute Stick STK2M3W64CC, STK2MV64CC and STK2M364CC Technical Product Specification 1.12.1.5 Intel® Identity Protection Technology Intel Identity Protection Technology (Intel IPT) provides a simple way for websites and enterprises to validate that a user is logging in from a trusted computer.
2 Technical Reference 2.1 Memory Resources 2.1.1 Addressable Memory The Intel Compute Stick utilizes up to 4 GB of addressable system memory. Typically the address space that is allocated for PCI Conventional bus add-in cards, PCI Express configuration space, BIOS (SPI Flash device), and chipset overhead resides above the top of DRAM (total system memory).
Intel Compute Stick STK2M3W64CC, STK2MV64CC and STK2M364CC Technical Product Specification 2.2 Connectors This section describes the connectors available on the Intel Compute Stick. 2.2.1 USB 3.0 Connector The Intel Compute Stick has a single full size USB 3.0 connector that supports compliant USB devices. Bootable USB devices are supported. Figure 4. USB 3.0 Connector NOTE It is recommended to only use a powered USB Hub with the Compute Stick’s USB port. 2.2.
Technical Reference 2.2.3 Power Adapter Connector The Intel Compute Stick is powered through a USB 5V DC connector on the side. The maximum current rating is 4A. Figure 6. Power Adapter Connector 2.2.4 Power Adapter and USB Hub The Intel Compute Stick uses a 5V 4A AC to DC power adapter with a built in 2-port USB 3.0 Hub. The power adapter is connected to the Intel Compute Stick via a six foot USB Type C cable. Each USB 3.0 port supports compliant USB devices. Bootable USB devices are supported.
Intel Compute Stick STK2M3W64CC, STK2MV64CC and STK2M364CC Technical Product Specification NOTE It is recommended to only use a powered USB Hub with the power adapter’s USB ports. NOTE The supplied power adapter and cable is required to power the Intel Compute Stick. Powering the Intel Compute Stick using any other power source is not supported. 2.2.5 Security Loop The Intel Compute Stick has a 3mm x 3mm opening in the chassis to allow for securing the Compute Stick. Figure 8.
Technical Reference Use of a wire rope type cable that is >3mm can be used with crimps to secure the Compute Stick. One example is shown below. However, many different options are available via 3rd party suppliers. Figure 9.
Intel Compute Stick STK2M3W64CC, STK2MV64CC and STK2M364CC Technical Product Specification 2.3 Mechanical Considerations 2.3.1 Form Factor Figure 10 illustrates the mechanical form factor for the Intel Compute Stick. Dimensions are given in millimeters. Figure 10. Intel Compute Stick Dimensions Table 6. Intel Compute Stick Weight Information 2.4 Item Weight Compute Stick only 60.2g Compute Stick in package 425.
Technical Reference 2.5 Environmental Table 7 lists the environmental specifications for the Compute Stick. Table 7. Environmental Specifications Parameter Specification Temperature Non-Operating -40 °C to +60 °C Operating 0 °C to +35 °C The operating temperature of the Compute Stick may be determined by measuring the air temperature from the outside of the chassis while the system is in operation1.
Intel Compute Stick STK2M3W64CC, STK2MV64CC and STK2M364CC Technical Product Specification 28
3 Overview of BIOS Features 3.1 Introduction The Compute Stick uses an Intel BIOS that is stored in the Serial Peripheral Interface Flash Memory (SPI Flash) and can be updated using a disk-based program. The SPI Flash contains the BIOS Setup program, POST, the PCI auto-configuration utility, and Plug and Play support. The initial production BIOSs are identified as CCSKLM30.86A or CCSKLM5V.86A.
Intel Compute Stick STK2M3W64CC, STK2MV64CC and STK2M364CC Technical Product Specification 3.4 Legacy USB Support Legacy USB support enables USB devices to be used even when the operating system’s USB drivers are not yet available. Legacy USB support is used to access the BIOS Setup program, and to install an operating system that supports USB. By default, Legacy USB support is set to Enabled. Legacy USB support operates as follows: 1. When you apply power to the computer, legacy support is disabled. 2.
Overview of BIOS Features 3.5.1 Language Support The BIOS Setup program and help messages are supported in US English. Check the Intel web site for support. 3.6 BIOS Recovery It is unlikely that anything will interrupt a BIOS update; however, if an interruption occurs, the BIOS could be damaged. Table 8 lists the drives and media types that can and cannot be used for BIOS recovery. The BIOS recovery media does not need to be made bootable. Table 8.
Intel Compute Stick STK2M3W64CC, STK2MV64CC and STK2M364CC Technical Product Specification 3.7.2 BIOS POST Hotkeys The following hot keys are supported during boot. [F2] Enter BIOS Setup [F7] Update BIOS [F8] Activate Windows Recovery Mode [F10] Enter Boot Menu 3.7.3 Changing the Default Boot Device During POST Pressing the key during POST causes a boot device menu to be displayed. This menu displays the list of available boot devices. Table 9 lists the boot device menu options. Table 9.
Overview of BIOS Features 3.8 BIOS Error Messages Table 10 lists the error messages and provides a brief description of each. Table 10. BIOS Error Messages Error Message Explanation CMOS Battery Low The battery may be losing power. Replace the battery soon. CMOS Checksum Bad The CMOS checksum is incorrect. CMOS memory may have been corrupted. Run Setup to reset values. No Boot Device Available System did not find a device to boot.
Intel Compute Stick STK2M3W64CC, STK2MV64CC and STK2M364CC Technical Product Specification 34
